Inventor
RITA ROBERT A
US29 patents
⚠️ This page may combine multiple inventors who share the name “RITA ROBERT A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
27 patentsUS6072690AJun 6, 2000
High k dielectric capacitor with low k sheathed signal vias
IBM152 citations99
US6178082B1Jan 23, 2001
High temperature, conductive thin film diffusion barrier for ceramic/metal systems
IBM129 citations98
US6023407AFeb 8, 2000
Structure for a thin film multilayer capacitor
IBM80 citations96
US5283104AFeb 1, 1994
Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates
IBM80 citations94
US6461493B1Oct 8, 2002
Decoupling capacitor method and structure using metal based carrier
IBM23 citations92
US6430030B2Aug 6, 2002
High k dielectric material with low k dielectric sheathed signal vias
IBM34 citations92
US6339527B1Jan 15, 2002
Thin film capacitor on ceramic
IBM41 citations92
US6216324B1Apr 17, 2001
Method for a thin film multilayer capacitor
IBM37 citations92
US6200400B1Mar 13, 2001
Method for making high k dielectric material with low k dielectric sheathed signal vias
IBM34 citations92
US6285080B1Sep 4, 2001
Planar metallized substrate with embedded camber control material and method thereof
IBM21 citations91
US6117367ASep 12, 2000
Pastes for improved substrate dimensional control
IBM22 citations91
US5337475AAug 16, 1994
Process for producing ceramic circuit structures having conductive vias
IBM37 citations91
US6713686B2Mar 30, 2004
Apparatus and method for repairing electronic packages
IBM16 citations84
US6210545B1Apr 3, 2001
Method for forming a perovskite thin film using a sputtering method with a fully oxidized perovskite target
IBM15 citations82
US6436332B1Aug 20, 2002
Low loss glass ceramic composition with modifiable dielectric constant
IBM5 citations74
US6171988B1Jan 9, 2001
Low loss glass ceramic composition with modifiable dielectric constant
IBM11 citations74
US6475555B2Nov 5, 2002
Process for screening features on an electronic substrate with a low viscosity paste
IBM7 citations73
US6231707B1May 15, 2001
Method of forming a multilayer ceramic substrate with max-punched vias
IBM8 citations73
US5489465AFeb 6, 1996
Edge seal technology for low dielectric/porous substrate processing
IBM6 citations72
US6413339B1Jul 2, 2002
Low temperature sintering of ferrite materials
IBM7 citations71
US6254925B1Jul 3, 2001
Source metal embedded in an inert material and process thereof
IBM2 citations63
US4478947AOct 23, 1984
Gas panel seal glass
IBM2 citations63
US7294909B2Nov 13, 2007
Electronic package repair process
IBM2 citations60
US6823585B2Nov 30, 2004
Method of selective plating on a substrate
IBM2 citations60
US5948193ASep 7, 1999
Process for fabricating a multilayer ceramic substrate from thin greensheet
IBM6 citations58
US6916670B2Jul 12, 2005
Electronic package repair process
IBM1 citations49
US7608295B2Oct 27, 2009
Polyimide compositions and use thereof in ceramic product defect repair
IBM0 citations48