Inventor
LEU FANG-JUN
TW9 patents
Patents
9 patentsUS5243493ASep 7, 1993
Fanless convection cooling design for personal computers
IND TECH RES INST81 citations94
US7091592B2Aug 15, 2006
Stacked package for electronic elements and packaging method thereof
IND TECH RES INST30 citations92
US7411306B2Aug 12, 2008
Packaging structure and method of an image sensor module
IND TECH RES INST17 citations90
US6166435ADec 26, 2000
Flip-chip ball grid array package with a heat slug
IND TECH RES INST25 citations89
US7572676B2Aug 11, 2009
Packaging structure and method of an image sensor module
IND TECH RES INST10 citations82
US7544529B2Jun 9, 2009
Image sensor packaging structure and method of manufacturing the same
IND TECH RES INST7 citations73
US7417293B2Aug 26, 2008
Image sensor packaging structure
IND TECH RES INST5 citations73
US10672677B2Jun 2, 2020
Semiconductor package structure
IND TECH RES INST2 citations70
US11114387B2Sep 7, 2021
Electronic packaging structure
IND TECH RES INST0 citations51