Inventor

DAY CHIANG-HAN

TW2 patents

Patents

2 patents

US6536653B2Mar 25, 2003

One-step bumping/bonding method for forming semiconductor packages

IND TECH RES INST21 citations89

US6166435ADec 26, 2000

Flip-chip ball grid array package with a heat slug

IND TECH RES INST25 citations89