Inventor
LEE DAWN MICHELLE
US2 patents
Patents
2 patentsUS6489242B1Dec 3, 2002
Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structures
LSI LOGIC CORP7 citations70
US6713394B2Mar 30, 2004
Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structures
LSI LOGIC CORP1 citations48