Inventor

OKAMOTO MASAHIDE

JP22 patents

⚠️ This page may combine multiple inventors who share the name “OKAMOTO MASAHIDE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OKAMOTO MASAHIDE

HITACHI LTD

Product using Zn-Al alloy solder

Electron device and semiconductor device

Electronic circuit device

Semiconductor package and computer using it

Electronic device

Method for producing multilayer ceramic body with convex side faces

Packaging method using lead-free solder

Circuit substrate and manufacture thereof, ceramic composition for circuit substrate, and electronics computer

Circuit substrate and electronics computer, using sintered glass ceramics

Ceramics substrate with electronic circuit and its manufacturing method

Packaging method using lead-free solder

Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly

Method of manufacturing via interconnection of glass-ceramic wiring board

Glass-ceramic wiring board

Method for manufacturing a semiconductor device using an Al-Zn connecting material

RENESAS TECH CORP

Semiconductor device and manufacturing method of the same

Solder foil, semiconductor device and electronic device

Semiconductor device and method for manufacturing thereof

Semiconductor device and manufacturing method thereof

OKAMOTO MASAHIDE

Metal strip, connector, and method of manufacturing metal strip

Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer

YAMAGUCHI TAKUTO

Junction material, manufacturing method thereof, and manufacturing method of junction structure