Inventor
HONG SUG-HUN
KR22 patents
⚠️ This page may combine multiple inventors who share the name “HONG SUG-HUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
17 patentsUS6383877B1May 7, 2002
Method of forming T-shaped isolation layer, method of forming elevated salicide source/drain region using the same, and semiconductor device having T-shaped isolation layer
SAMSUNG ELECTRONICS CO LTD49 citations96
US6255194B1Jul 3, 2001
Trench isolation method
SAMSUNG ELECTRONICS CO LTD66 citations96
US6037237AMar 14, 2000
Trench isolation methods utilizing composite oxide films
SAMSUNG ELECTRONICS CO LTD74 citations96
US6624496B2Sep 23, 2003
Method of forming T-shaped isolation layer, method of forming elevated salicide source/drain region using the same, and semiconductor device having T-shaped isolation layer
SAMSUNG ELECTRONICS CO LTD29 citations92
US6501149B2Dec 31, 2002
Semiconductor device having trench isolation structure and method of forming same
SAMSUNG ELECTRONICS CO LTD29 citations92
US5926721AJul 20, 1999
Isolation method for semiconductor device using selective epitaxial growth
SAMSUNG ELECTRONICS CO LTD19 citations92
US7972950B2Jul 5, 2011
Method of fabricating semiconductor device having dual gate
SAMSUNG ELECTRONICS CO LTD8 citations84
US7053006B2May 30, 2006
Methods of fabricating oxide layers by plasma nitridation and oxidation
SAMSUNG ELECTRONICS CO LTD11 citations84
US9543300B2Jan 10, 2017
CMOS transistor, semiconductor device including the transistor, and semiconductor module including the device
SAMSUNG ELECTRONICS CO LTD2 citations73
US7319062B2Jan 15, 2008
Trench isolation method with an epitaxially grown capping layer
SAMSUNG ELECTRONICS CO LTD7 citations73
US6642596B2Nov 4, 2003
Semiconductor device having trench isolation structure and method of forming same
SAMSUNG ELECTRONICS CO LTD12 citations73
US5903040AMay 11, 1999
Trench isolated integrated circuits including voids
SAMSUNG ELECTRONICS CO LTD15 citations73
US9236313B2Jan 12, 2016
Method of fabricating semiconductor device having dual gate
SAMSUNG ELECTRONICS CO LTD1 citations63
US7692196B2Apr 6, 2010
Memory devices and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations63
US7696563B2Apr 13, 2010
Non-volatile memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US8367502B2Feb 5, 2013
Method of manufacturing dual gate semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations49
US7910421B2Mar 22, 2011
Methods of forming devices including different gate insulating layers on PMOS/NMOS regions
SAMSUNG ELECTRONICS CO LTD0 citations49