P

Inventor

HONG SUG-HUN

KR22 patents
⚠️ This page may combine multiple inventors who share the name “HONG SUG-HUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

17 patents
US6383877B1May 7, 2002

Method of forming T-shaped isolation layer, method of forming elevated salicide source/drain region using the same, and semiconductor device having T-shaped isolation layer

SAMSUNG ELECTRONICS CO LTD49 citations96
US6255194B1Jul 3, 2001

Trench isolation method

SAMSUNG ELECTRONICS CO LTD66 citations96
US6037237AMar 14, 2000

Trench isolation methods utilizing composite oxide films

SAMSUNG ELECTRONICS CO LTD74 citations96
US6624496B2Sep 23, 2003

Method of forming T-shaped isolation layer, method of forming elevated salicide source/drain region using the same, and semiconductor device having T-shaped isolation layer

SAMSUNG ELECTRONICS CO LTD29 citations92
US6501149B2Dec 31, 2002

Semiconductor device having trench isolation structure and method of forming same

SAMSUNG ELECTRONICS CO LTD29 citations92
US5926721AJul 20, 1999

Isolation method for semiconductor device using selective epitaxial growth

SAMSUNG ELECTRONICS CO LTD19 citations92
US7972950B2Jul 5, 2011

Method of fabricating semiconductor device having dual gate

SAMSUNG ELECTRONICS CO LTD8 citations84
US7053006B2May 30, 2006

Methods of fabricating oxide layers by plasma nitridation and oxidation

SAMSUNG ELECTRONICS CO LTD11 citations84
US9543300B2Jan 10, 2017

CMOS transistor, semiconductor device including the transistor, and semiconductor module including the device

SAMSUNG ELECTRONICS CO LTD2 citations73
US7319062B2Jan 15, 2008

Trench isolation method with an epitaxially grown capping layer

SAMSUNG ELECTRONICS CO LTD7 citations73
US6642596B2Nov 4, 2003

Semiconductor device having trench isolation structure and method of forming same

SAMSUNG ELECTRONICS CO LTD12 citations73
US5903040AMay 11, 1999

Trench isolated integrated circuits including voids

SAMSUNG ELECTRONICS CO LTD15 citations73
US9236313B2Jan 12, 2016

Method of fabricating semiconductor device having dual gate

SAMSUNG ELECTRONICS CO LTD1 citations63
US7692196B2Apr 6, 2010

Memory devices and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD4 citations63
US7696563B2Apr 13, 2010

Non-volatile memory device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations52
US8367502B2Feb 5, 2013

Method of manufacturing dual gate semiconductor device

SAMSUNG ELECTRONICS CO LTD1 citations49
US7910421B2Mar 22, 2011

Methods of forming devices including different gate insulating layers on PMOS/NMOS regions

SAMSUNG ELECTRONICS CO LTD0 citations49

NA HOON-JOO

2 patents

SAMSUNG ELECTRONICS CO INC

1 patent

PARK HONG-BAE

1 patent

LEE HYE-LAN

1 patent