P

Inventor

TAN LOON KWANG

MY9 patents
⚠️ This page may combine multiple inventors who share the name “TAN LOON KWANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ALTERA CORP

4 patents
US9425174B1Aug 23, 2016

Integrated circuit package with solderless interconnection structure

ALTERA CORP8 citations81
US7989942B2Aug 2, 2011

IC package with capacitors disposed on an interposal layer

ALTERA CORP10 citations81
US9401287B2Jul 26, 2016

Methods for packaging integrated circuits

ALTERA CORP3 citations70
US9748197B2Aug 29, 2017

Methods for packaging integrated circuits

ALTERA CORP0 citations49

LUMILEDS LLC

2 patents
US12191280B2Jan 7, 2025

Ceramic carrier and build up carrier for light-emitting diode (LED) array

LUMILEDS LLC0 citations61
US11664347B2May 30, 2023

Ceramic carrier and build up carrier for light-emitting diode (LED) array

LUMILEDS LLC0 citations61

TOONG TEIK TIONG

2 patents
US8525326B2Sep 3, 2013

IC package with capacitors disposed on an interposal layer

TOONG TEIK TIONG3 citations57
US8541263B1Sep 24, 2013

Thermoset molding for on-package decoupling in flip chips

TOONG TEIK TIONG1 citations46

LEE GUAN KHAI

1 patent
US9337240B1May 10, 2016

Integrated circuit package with a universal lead frame

LEE GUAN KHAI1 citations35