Inventor
MIYAKE HIDETAKA
JP25 patents
⚠️ This page may combine multiple inventors who share the name “MIYAKE HIDETAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
13 patentsUS5919380AJul 6, 1999
Three-dimensional electrical discharge machining method and apparatus utilizing NC control
MITSUBISHI ELECTRIC CORP52 citations92
US7518081B2Apr 14, 2009
Electric discharge machining apparatus
MITSUBISHI ELECTRIC CORP11 citations84
US6788019B2Sep 7, 2004
Electric discharge machining device and electric discharge machining method
MITSUBISHI ELECTRIC CORP11 citations74
US5973498AOct 26, 1999
EDM with jump motion detecting reactive force
MITSUBISHI ELECTRIC CORP9 citations74
US10300542B2May 28, 2019
Wire electrical discharge machining apparatus and method of manufacturing semiconductor wafer
MITSUBISHI ELECTRIC CORP3 citations73
US5837957ANov 17, 1998
Electric discharge machining apparatus
MITSUBISHI ELECTRIC CORP12 citations73
US6881918B2Apr 19, 2005
Electric discharge machining apparatus
MITSUBISHI ELECTRIC CORP5 citations63
US6621033B2Sep 16, 2003
Electrical discharge machining apparatus
MITSUBISHI ELECTRIC CORP4 citations63
US6614234B1Sep 2, 2003
Electric discharge machine
MITSUBISHI ELECTRIC CORP4 citations63
US6147500ANov 14, 2000
EDM with jump motion detecting reactive force
MITSUBISHI ELECTRIC CORP1 citations63
US6781080B1Aug 24, 2004
Wire electric discharge machine with stored discharge energy threshold function
MITSUBISHI ELECTRIC CORP5 citations62
US9643270B2May 9, 2017
Wire discharge-machining apparatus with parallel cutting wires
MITSUBISHI ELECTRIC CORP0 citations52
US10220459B2Mar 5, 2019
Wire electric discharge machining apparatus and manufacturing method for thin plate and manufacturing method for semiconductor wafer using wire electric discharge machining apparatus
MITSUBISHI ELECTRIC CORP0 citations40
MIYAKE HIDETAKA
4 patentsUS9950379B2Apr 24, 2018
Wire electric discharge machining apparatus
MIYAKE HIDETAKA1 citations50
US9387548B2Jul 12, 2016
Wire-cut electrical discharge machining apparatus and semiconductor wafer manufacturing method
MIYAKE HIDETAKA1 citations50
US9050672B2Jun 9, 2015
Wire discharge-machining apparatus with parallel cutting wires
MIYAKE HIDETAKA0 citations50
US8664559B2Mar 4, 2014
Electrical discharge machine
MIYAKE HIDETAKA0 citations50
FUJI XEROX CO LTD
2 patentsUS5524067AJun 4, 1996
Image processing device employing coding with edge information preserved
FUJI XEROX CO LTD81 citations94
US6622139B1Sep 16, 2003
Information retrieval apparatus and computer-readable recording medium having information retrieval program recorded therein
FUJI XEROX CO LTD30 citations92
JAPAN SCIENCE & TECH CORP
2 patentsITOKAZU ATSUSHI
2 patentsUS9089916B2Jul 28, 2015
Wire electric discharge machining apparatus, wire electric discharge machining method, thin plate manufacturing method, and semiconductor wafer manufacturing method
ITOKAZU ATSUSHI3 citations57
US9707638B2Jul 18, 2017
Wire electric-discharge machining device, wire electric-discharge machining method, thin-plate manufacturing method, and semiconductor wafer manufacturing method
ITOKAZU ATSUSHI0 citations45