P

Inventor

BUDINGER WILLIAM D

US30 patents
⚠️ This page may combine multiple inventors who share the name “BUDINGER WILLIAM D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RODEL INC

21 patents
US6022264AFeb 8, 2000

Polishing pad and methods relating thereto

RODEL INC99 citations98
US6069080AMay 30, 2000

Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like

RODEL INC126 citations97
US5900164AMay 4, 1999

Method for planarizing a semiconductor device surface with polymeric pad containing hollow polymeric microelements

RODEL INC141 citations97
US5578362ANov 26, 1996

Polymeric polishing pad containing hollow polymeric microelements

RODEL INC433 citations97
US4927432AMay 22, 1990

Pad material for grinding, lapping and polishing

RODEL INC231 citations97
US6488570B1Dec 3, 2002

Method relating to a polishing system having a multi-phase polishing layer

RODEL INC68 citations96
US6375559B1Apr 23, 2002

Polishing system having a multi-phase polishing substrate and methods relating thereto

RODEL INC61 citations96
US6210254B1Apr 3, 2001

Method of manufacturing a polymeric polishing pad having photolithographically induced surface pattern(s)

RODEL INC45 citations96
US6099394AAug 8, 2000

Polishing system having a multi-phase polishing substrate and methods relating thereto

RODEL INC82 citations96
US6036579AMar 14, 2000

Polymeric polishing pad having photolithographically induced surface patterns(s) and methods relating thereto

RODEL INC82 citations96
US5932486AAug 3, 1999

Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers

RODEL INC83 citations96
US6439989B1Aug 27, 2002

Polymeric polishing pad having continuously regenerated work surface

RODEL INC39 citations95
US6517417B2Feb 11, 2003

Polishing pad with a transparent portion

RODEL INC38 citations93
US6375694B1Apr 23, 2002

Polishing slurry compositions capable of providing multi-modal particle packing

RODEL INC19 citations93
US6093649AJul 25, 2000

Polishing slurry compositions capable of providing multi-modal particle packing and methods relating thereto

RODEL INC43 citations93
US6030899AFeb 29, 2000

Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers

RODEL INC21 citations93
US6337281B1Jan 8, 2002

Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like

RODEL INC44 citations92
US4198739AApr 22, 1980

Printing roller with polymeric coner and method of making the same

RODEL INC60 citations89
US6245679B1Jun 12, 2001

Apparatus and methods for chemical-mechanical polishing of semiconductor wafers

RODEL INC13 citations74
US6210525B1Apr 3, 2001

Apparatus and methods for chemical-mechanical polishing of semiconductor wafers

RODEL INC14 citations74
US6518188B2Feb 11, 2003

Apparatus and methods for chemical-mechanical polishing of semiconductor wafers

RODEL INC3 citations63

BUDINGER WILLIAM D

5 patents

ROHM & HAAS ELECT MAT

3 patents

(unassigned)

1 patent