Inventor

KOGURE SEIJI

JP4 patents

⚠️ This page may combine multiple inventors who share the name “KOGURE SEIJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJITSU LTD

3 patents

US5182853AFeb 2, 1993

Method for encapsulting IC chip

FUJITSU LTD25 citations90

US6498307B2Dec 24, 2002

Electronic component package, printing circuit board, and method of inspecting the printed circuit board

FUJITSU LTD6 citations70

US5337467AAug 16, 1994

Method of producing wire-bonded substrate assembly

FUJITSU LTD9 citations70

FUJISTU LTD

1 patent

US6727718B2Apr 27, 2004

Electronic component package, printed circuit board, and method of inspecting the printed circuit board

FUJISTU LTD7 citations70