Inventor
NIISHIRO MAMORU
JP4 patents
Patents
4 patentsUS5828128AOct 27, 1998
Semiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor device
FUJITSU LTD160 citations96
US5760469AJun 2, 1998
Semiconductor device and semiconductor device mounting board
FUJITSU LTD46 citations90
US5413164AMay 9, 1995
Heating furnace in combination with electronic circuit modules
FUJITSU LTD40 citations89
US5337467AAug 16, 1994
Method of producing wire-bonded substrate assembly
FUJITSU LTD9 citations70