Inventor
HERING RONALD L
US10 patents
Patents
10 patentsUS6436223B1Aug 20, 2002
Process and apparatus for improved module assembly using shape memory alloy springs
IBM21 citations91
US6332946B1Dec 25, 2001
Method for assembling a multi-layered ceramic package
IBM41 citations89
US6112795ASep 5, 2000
Fixture for multi-layered ceramic package assembly
IBM22 citations89
US7086896B2Aug 8, 2006
Expandable standoff connector with slit collar and related method
IBM12 citations83
US7239516B2Jul 3, 2007
Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip
IBM7 citations73
US6049456AApr 11, 2000
Electronic module adjustment design and process using shims
IBM12 citations73
US6964885B2Nov 15, 2005
Stress resistant land grid array (LGA) module and method of forming the same
IBM9 citations71
US6703560B2Mar 9, 2004
Stress resistant land grid array (LGA) module and method of forming the same
IBM7 citations71
US6444082B1Sep 3, 2002
Apparatus and method for removing a bonded lid from a substrate
IBM10 citations71
US7394666B2Jul 1, 2008
Circuit board cam-action standoff connector
IBM6 citations62