Inventor

NADAMOTO KEISUKE

JP5 patents

⚠️ This page may combine multiple inventors who share the name “NADAMOTO KEISUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI LTD

2 patents

US6279226B1Aug 28, 2001

Lead bonding machine for bonding leads of a chip disposed over a carrier tape to an electrode pad formed on the chip

HITACHI LTD32 citations89

US6516515B2Feb 11, 2003

Semiconductor integrated circuit

HITACHI LTD2 citations60

RENESAS TECH CORP

2 patents

US7629231B2Dec 8, 2009

Fabrication method of semiconductor device

RENESAS TECH CORP13 citations81

US6898848B2May 31, 2005

Method of bonding inner leads to chip pads

RENESAS TECH CORP6 citations71

MAKI HIROSHI

1 patent

US8703583B2Apr 22, 2014

Fabrication method of semiconductor device

MAKI HIROSHI12 citations81