Inventor
CHOI BAIK-SOON
KR22 patents
⚠️ This page may combine multiple inventors who share the name “CHOI BAIK-SOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
21 patentsUS6213856B1Apr 10, 2001
Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk
SAMSUNG ELECTRONICS CO LTD166 citations98
US6179955B1Jan 30, 2001
Dry etching apparatus for manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD344 citations98
US6216548B1Apr 17, 2001
Method for sampling particles present in a processing chamber
SAMSUNG ELECTRONICS CO LTD44 citations92
US6432838B1Aug 13, 2002
Chemical vapor deposition apparatus for manufacturing semiconductor devices, its driving method, and method of optimizing recipe of cleaning process for process chamber
SAMSUNG ELECTRONICS CO LTD14 citations91
US6279503B1Aug 28, 2001
Chemical vapor deposition apparatus for manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD31 citations91
US6251241B1Jun 26, 2001
Inductive-coupled plasma apparatus employing shield and method for manufacturing the shield
SAMSUNG ELECTRONICS CO LTD18 citations91
US6146492ANov 14, 2000
Plasma process apparatus with in situ monitoring, monitoring method, and in situ residue cleaning method
SAMSUNG ELECTRONICS CO LTD41 citations90
US6335284B1Jan 1, 2002
Metallization process for manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD16 citations80
US6119532ASep 19, 2000
Apparatus and method for particle sampling during semiconductor device manufacturing
SAMSUNG ELECTRONICS CO LTD14 citations74
US6740169B2May 25, 2004
Method of reworking a conditioning disk
SAMSUNG ELECTRONICS CO LTD6 citations73
US6664119B2Dec 16, 2003
Chemical vapor deposition method for manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD12 citations72
US10894935B2Jan 19, 2021
Composition for removing silicone resins and method of thinning substrate by using the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US6589719B1Jul 8, 2003
Photoresist stripper compositions
SAMSUNG ELECTRONICS CO LTD10 citations71
US6499492B1Dec 31, 2002
Plasma process apparatus with in situ monitoring, monitoring method, and in situ residue cleaning
SAMSUNG ELECTRONICS CO LTD10 citations71
US6682876B2Jan 27, 2004
Thinner composition and method of stripping a photoresist using the same
SAMSUNG ELECTRONICS CO LTD7 citations69
US7387988B2Jun 17, 2008
Thinner composition and method of removing photoresist using the same
SAMSUNG ELECTRONICS CO LTD4 citations62
US6494927B2Dec 17, 2002
Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk
SAMSUNG ELECTRONICS CO LTD3 citations62
US7863231B2Jan 4, 2011
Thinner composition and method of removing photoresist using the same
SAMSUNG ELECTRONICS CO LTD1 citations51
US6596087B2Jul 22, 2003
Method of cleaning conditioning disk
SAMSUNG ELECTRONICS CO LTD0 citations51
US6585907B2Jul 1, 2003
Method for manufacturing a shield for an inductively-couple plasma apparatus
SAMSUNG ELECTRONICS CO LTD0 citations51
US9840785B2Dec 12, 2017
Tin plating solution, tin plating equipment, and method for fabricating semiconductor device using the tin plating solution
SAMSUNG ELECTRONICS CO LTD0 citations50