Inventor
KAYUKAWA KIMIHARU
JP8 patents
⚠️ This page may combine multiple inventors who share the name “KAYUKAWA KIMIHARU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENSO CORP
6 patentsUS7470996B2Dec 30, 2008
Packaging method
DENSO CORP32 citations90
US7420246B2Sep 2, 2008
Vertical type semiconductor device and method for manufacturing the same
DENSO CORP7 citations72
US7361996B2Apr 22, 2008
Semiconductor device having tin-based solder layer and method for manufacturing the same
DENSO CORP2 citations61
US7659127B2Feb 9, 2010
Manufacturing device of semiconductor package and manufacturing method of semiconductor package
DENSO CORP2 citations55
US7971349B2Jul 5, 2011
Bump bonding method
DENSO CORP1 citations51
US7579212B2Aug 25, 2009
Semiconductor device having tin-based solder layer and method for manufacturing the same
DENSO CORP0 citations51