Inventor

OZONO MITSURU

JP18 patents

⚠️ This page may combine multiple inventors who share the name “OZONO MITSURU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OZONO MITSURU

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Paste application method for die bonding

Semiconductor device, method of manufacturing the device and method of mounting the device

Method of mounting bumped electronic components

Method of soldering bumped work by partially penetrating the oxide film covering the solder bumps

Semiconductor device and method for assembling the same

Bonding paste applicator and method of using it

Paste applying method

Electronic component mounting apparatus and method of mounting electronic components

Method of manufacturing semiconductor device

Semiconductor device and semiconductor device assembly

Paste ejection apparatus

Paste applicator and paste application method for die bonding

Method of applying bonding paste

PANASONIC CORP

Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used therefor

Method for soldering electronic component and soldering structure of electronic component

HAJI HIROSHI

Component bonding method, component laminating method and bonded component structure

Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method

OZONO MITSURU

Electronic component soldering structure and electronic component soldering method