Inventor

CHAN KUN-CHIH

TW2 patents

⚠️ This page may combine multiple inventors who share the name “CHAN KUN-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG KAI-JUN

1 patent

US8703508B2Apr 22, 2014

Method for wafer-level testing diced multi-chip stacked packages

CHANG KAI-JUN22 citations81

POWERTECH TECHNOLOGY INC

1 patent

US9250288B2Feb 2, 2016

Wafer-level testing method for singulated 3D-stacked chip cubes

POWERTECH TECHNOLOGY INC0 citations35