Inventor
HONG SUKWON
US21 patents
⚠️ This page may combine multiple inventors who share the name “HONG SUKWON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLOBALFOUNDRIES INC
6 patentsUS9722053B1Aug 1, 2017
Methods, apparatus and system for local isolation formation for finFET devices
GLOBALFOUNDRIES INC6 citations84
US9236308B1Jan 12, 2016
Methods of fabricating fin structures of uniform height
GLOBALFOUNDRIES INC9 citations84
US9831098B2Nov 28, 2017
Methods for fabricating integrated circuits using flowable chemical vapor deposition techniques with low-temperature thermal annealing
GLOBALFOUNDRIES INC3 citations67
US9324799B2Apr 26, 2016
FinFET structures having uniform channel size and methods of fabrication
GLOBALFOUNDRIES INC2 citations63
US10014209B2Jul 3, 2018
Methods, apparatus and system for local isolation formation for finFET devices
GLOBALFOUNDRIES INC0 citations52
US9646884B2May 9, 2017
Block level patterning process
GLOBALFOUNDRIES INC0 citations42
GWANGJU INST SCIENCE & TECH
4 patentsUS11559797B2Jan 24, 2023
Acyclic carbene ligand for ruthenium complex formation, ruthenium complex catalyst, and use thereof
GWANGJU INST SCIENCE & TECH0 citations58
US11471867B2Oct 18, 2022
Ligand for forming ruthenium complex, ruthenium complex catalyst, production method therefor and use thereof
GWANGJU INST SCIENCE & TECH0 citations58
US11964991B2Apr 23, 2024
Ruthenium complex compound, ligand for producing same, and use thereof
GWANGJU INST SCIENCE & TECH0 citations47
US11217398B2Jan 4, 2022
BODIPY-based copolymer and solar cell comprising same
GWANGJU INST SCIENCE & TECH0 citations41
IBM
3 patentsUS9583442B2Feb 28, 2017
Interconnect structure including middle of line (MOL) metal layer local interconnect on etch stop layer
IBM5 citations84
US9786607B2Oct 10, 2017
Interconnect structure including middle of line (MOL) metal layer local interconnect on ETCH stop layer
IBM2 citations73
US9728456B2Aug 8, 2017
Interconnect structure including middle of line (MOL) metal layer local interconnect on etch stop layer
IBM0 citations52