Inventor
DIAS RAJENDRA C
US23 patents
⚠️ This page may combine multiple inventors who share the name “DIAS RAJENDRA C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
21 patentsUS10461007B2Oct 29, 2019
Semiconductor package with electromagnetic interference shielding
INTEL CORP8 citations83
US10192810B2Jan 29, 2019
Underfill material flow control for reduced die-to-die spacing in semiconductor packages
INTEL CORP13 citations83
US9685413B1Jun 20, 2017
Semiconductor package having an EMI shielding layer
INTEL CORP12 citations78
US10685949B2Jun 16, 2020
Flexible electronic system with wire bonds
INTEL CORP4 citations73
US10535615B2Jan 14, 2020
Electronic package that includes multi-layer stiffener
INTEL CORP2 citations72
US9953929B2Apr 24, 2018
Systems and methods for electromagnetic interference shielding
INTEL CORP2 citations72
US9721906B2Aug 1, 2017
Electronic package with corner supports
INTEL CORP2 citations71
US9591758B2Mar 7, 2017
Flexible electronic system with wire bonds
INTEL CORP4 citations70
US9991211B2Jun 5, 2018
Semiconductor package having an EMI shielding layer
INTEL CORP2 citations67
US9887104B2Feb 6, 2018
Electronic package and method of connecting a first die to a second die to form an electronic package
INTEL CORP2 citations67
US10468357B2Nov 5, 2019
Stretchable electronics fabrication method with strain redistribution layer
INTEL CORP1 citations60
US10229887B2Mar 12, 2019
Systems and methods for electromagnetic interference shielding
INTEL CORP1 citations60
US9431274B2Aug 30, 2016
Method for reducing underfill filler settling in integrated circuit packages
INTEL CORP2 citations59
US10634594B2Apr 28, 2020
Membrane test for mechanical testing of stretchable electronics
INTEL CORP1 citations57
US10615128B2Apr 7, 2020
Systems and methods for electromagnetic interference shielding
INTEL CORP0 citations51
US9704811B1Jul 11, 2017
Perforated conductive material for EMI shielding of semiconductor device and components
INTEL CORP0 citations51
US9230833B2Jan 5, 2016
Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures
INTEL CORP0 citations51
US8999765B2Apr 7, 2015
Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures
INTEL CORP1 citations51
US10763220B2Sep 1, 2020
Systems and methods for electromagnetic interference shielding
INTEL CORP0 citations50
US10206277B2Feb 12, 2019
Gradient encapsulant protection of devices in stretchable electronics
INTEL CORP0 citations49
US9508660B2Nov 29, 2016
Microelectronic die having chamfered corners
INTEL CORP0 citations45