Inventor

OSBORN TYLER N

US6 patents

⚠️ This page may combine multiple inventors who share the name “OSBORN TYLER N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

3 patents

US9397071B2Jul 19, 2016

High density interconnection of microelectronic devices

INTEL CORP2 citations62

US9312237B2Apr 12, 2016

Integrated circuit package with spatially varied solder resist opening dimension

INTEL CORP2 citations58

US9842832B2Dec 12, 2017

High density interconnection of microelectronic devices

INTEL CORP0 citations52

ZHENG TIEYU

1 patent

US8952532B2Feb 10, 2015

Integrated circuit package with spatially varied solder resist opening dimension

ZHENG TIEYU7 citations77

SHI HUALIANG

1 patent

US8970051B2Mar 3, 2015

Solution to deal with die warpage during 3D die-to-die stacking

SHI HUALIANG12 citations74

DIAS RAJENDRA C

1 patent

US9786517B2Oct 10, 2017

Ablation method and recipe for wafer level underfill material patterning and removal

DIAS RAJENDRA C0 citations30