Inventor

MCPARTLIN MICHAEL JOSEPH

US21 patents

⚠️ This page may combine multiple inventors who share the name “MCPARTLIN MICHAEL JOSEPH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MCPARTLIN MICHAEL JOSEPH

SKYWORKS SOLUTIONS INC

Integrated RF front end system

Front-end integrated circuit for WLAN applications

Semiconductor die fabrication methods

Integrated RF front end system

Flip chip amplifier for wireless device

Integrated RF front end system

Solder bump placement for thermal management in flip chip amplifiers

Solder bump placement for grounding in flip chip amplifiers

Solder bump placement for emitter-ballasting in flip chip amplifiers

Direct substrate to solder bump connection for thermal management in flip chip amplifiers

Integrated RF front end system

Amplifier voltage limiting using punch-through effect

Direct substrate to solder bump connection for thermal management in flip chip amplifiers

Direct substrate to solder bump connection for thermal management in flip chip amplifiers

Fabrication of radio-frequency devices with amplifier voltage limiting features

Direct substrate to solder bump connection for thermal management in flip chip amplifiers

Amplifier voltage limiting in radio-frequency devices

WLAN front-end

MCPARTLIN MICHAEL JOSEPH

Integrated RF front end system

Bipolar transistor on high-resistivity substrate

SIGE SEMICONDUCTOR INC

Switching circuit