Inventor

HAN HYUN-JOO

KR6 patents

⚠️ This page may combine multiple inventors who share the name “HAN HYUN-JOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

2 patents

US7755181B2Jul 13, 2010

IC package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD16 citations82

US10426041B2Sep 24, 2019

Method of manufacturing printed-circuit board assembly

SAMSUNG ELECTRONICS CO LTD0 citations49

SAMSUNG SDI CO LTD

2 patents

US9771467B2Sep 26, 2017

Thermoplastic resin composition and article comprising the same

SAMSUNG SDI CO LTD2 citations70

US9085674B2Jul 21, 2015

Silane compound, method for preparing the same and polycarbonate resin composition comprising the same

SAMSUNG SDI CO LTD0 citations49

PARK MIN YOUNG

1 patent

US8327534B2Dec 11, 2012

Method of fabricating printed circuit board assembly

PARK MIN YOUNG3 citations59

CHEIL IND INC

1 patent

US9321886B2Apr 26, 2016

Silane compound, method for preparing the same, and polycarbonate resin composition including the same

CHEIL IND INC0 citations38