Inventor
Kuan Chin Lee
MY23 patents
Patents
23 patentsUS11133256B2Sep 28, 2021
Embedded bridge substrate having an integral device
INTEL CORP12 citations83
US11527479B2Dec 13, 2022
Stepped interposer for stacked chip package
INTEL CORP2 citations73
US10085342B2Sep 25, 2018
Microelectronic device having an air core inductor
INTEL CORP6 citations73
US10516366B2Dec 24, 2019
Crystal oscillator interconnect architecture with noise immunity
INTEL CORP3 citations71
US10171033B2Jan 1, 2019
Crystal oscillator interconnect architecture with noise immunity
INTEL CORP2 citations71
US12256487B2Mar 18, 2025
Hybrid boards with embedded planes
INTEL CORP0 citations62
US11557552B2Jan 17, 2023
3D trench reference planes for integrated-circuit die packages
INTEL CORP0 citations62
US11521943B2Dec 6, 2022
Method of forming a capacitive loop substrate assembly
INTEL CORP0 citations62
US11031359B2Jun 8, 2021
Capacitor loop structure
INTEL CORP0 citations62
US11696409B2Jul 4, 2023
Vertical embedded component in a printed circuit board blind hole
INTEL CORP0 citations61
US11502603B2Nov 15, 2022
Magnetic sensing scheme for voltage regulator circuit
INTEL CORP0 citations61
US11437294B2Sep 6, 2022
Structures to facilitate heat transfer within package layers to thermal heat sink and motherboard
INTEL CORP0 citations61
US11380623B2Jul 5, 2022
Shield to protect vias from electromagnetic interference
INTEL CORP0 citations61
US11342852B2May 24, 2022
Apparatus, system, and method for reducing voltage overshoot in voltage regulators
INTEL CORP0 citations61
US11290059B2Mar 29, 2022
Crystal oscillator interconnect architecture with noise immunity
INTEL CORP0 citations61
US11749606B2Sep 5, 2023
Embedded bridge substrate having an integral device
INTEL CORP0 citations59
US11264160B2Mar 1, 2022
Extended package air core inductor
INTEL CORP0 citations58
US11540395B2Dec 27, 2022
Stacked-component placement in multiple-damascene printed wiring boards for semiconductor package substrates
INTEL CORP0 citations52
US10985147B2Apr 20, 2021
Capacitors embedded in stiffeners for small form-factor and methods of assembling same
INTEL CORP0 citations52
US10083922B2Sep 25, 2018
Inductor interconnect
INTEL CORP1 citations52
US12474759B2Nov 18, 2025
Platform voltage regulator circuitry configurations
INTEL CORP0 citations51
US11562963B2Jan 24, 2023
Stacked semiconductor package and method of forming the same
INTEL CORP0 citations51
US10719109B2Jul 21, 2020
Noise mitigation apparatus and method with positively and negatively coupled inductors
INTEL CORP0 citations51