Inventor
HAO FANGLI
US24 patents
⚠️ This page may combine multiple inventors who share the name “HAO FANGLI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
22 patentsUS6949204B1Sep 27, 2005
Deformation reduction at the main chamber
LAM RES CORP415 citations99
US6432831B2Aug 13, 2002
Gas distribution apparatus for semiconductor processing
LAM RES CORP315 citations99
US6415736B1Jul 9, 2002
Gas distribution apparatus for semiconductor processing
LAM RES CORP365 citations99
US6245192B1Jun 12, 2001
Gas distribution apparatus for semiconductor processing
LAM RES CORP407 citations99
US6889627B1May 10, 2005
Symmetrical semiconductor reactor
LAM RES CORP54 citations96
US6363882B1Apr 2, 2002
Lower electrode design for higher uniformity
LAM RES CORP57 citations96
US6123775ASep 26, 2000
Reaction chamber component having improved temperature uniformity
LAM RES CORP159 citations96
US6350317B1Feb 26, 2002
Linear drive system for use in a plasma processing system
LAM RES CORP78 citations95
US7234222B1Jun 26, 2007
Methods and apparatus for optimizing the delivery of a set of gases in a plasma processing system
LAM RES CORP21 citations92
US6863784B2Mar 8, 2005
Linear drive system for use in a plasma processing system
LAM RES CORP15 citations92
US6669811B2Dec 30, 2003
Linear drive system for use in a plasma processing system
LAM RES CORP20 citations92
US6433484B1Aug 13, 2002
Wafer area pressure control
LAM RES CORP47 citations92
US5966586AOct 12, 1999
Endpoint detection methods in plasma etch processes and apparatus therefor
LAM RES CORP41 citations92
US10262887B2Apr 16, 2019
Pin lifter assembly with small gap
LAM RES CORP15 citations84
US7524397B2Apr 28, 2009
Lower electrode design for higher uniformity
LAM RES CORP9 citations84
US6922867B1Aug 2, 2005
Two position robot design for FOUP purge
LAM RES CORP15 citations84
US10910195B2Feb 2, 2021
Substrate support with improved process uniformity
LAM RES CORP3 citations72
US10741425B2Aug 11, 2020
Helium plug design to reduce arcing
LAM RES CORP4 citations72
US6712929B1Mar 30, 2004
Deformation reduction at the main chamber
LAM RES CORP3 citations63
US11984296B2May 14, 2024
Substrate support with improved process uniformity
LAM RES CORP0 citations61
US10460978B2Oct 29, 2019
Boltless substrate support assembly
LAM RES CORP0 citations51
US9689533B2Jun 27, 2017
Coating method for gas delivery system
LAM RES CORP0 citations49