Inventor
THAKUR RANDHIR P S
US254 patents
⚠️ This page may combine multiple inventors who share the name “THAKUR RANDHIR P S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
37 patentsUS6414376B1Jul 2, 2002
Method and apparatus for reducing isolation stress in integrated circuits
MICRON TECHNOLOGY INC212 citations99
US6325017B1Dec 4, 2001
Apparatus for forming a high dielectric film
MICRON TECHNOLOGY INC97 citations99
US5910880AJun 8, 1999
Semiconductor circuit components and capacitors
MICRON TECHNOLOGY INC98 citations99
US5656531AAug 12, 1997
Method to form hemi-spherical grain (HSG) silicon from amorphous silicon
MICRON TECHNOLOGY INC119 citations99
US6436818B1Aug 20, 2002
Semiconductor structure having a doped conductive layer
MICRON TECHNOLOGY INC114 citations98
US6362086B2Mar 26, 2002
Forming a conductive structure in a semiconductor device
MICRON TECHNOLOGY INC108 citations98
US6298470B1Oct 2, 2001
Method for efficient manufacturing of integrated circuits
MICRON TECHNOLOGY INC133 citations98
US6015997AJan 18, 2000
Semiconductor structure having a doped conductive layer
MICRON TECHNOLOGY INC87 citations98
US5963833AOct 5, 1999
Method for cleaning semiconductor wafers and
MICRON TECHNOLOGY INC92 citations98
US5837580ANov 17, 1998
Method to form hemi-spherical grain (HSG) silicon
MICRON TECHNOLOGY INC105 citations98
US5835225ANov 10, 1998
Surface properties detection by reflectance metrology
MICRON TECHNOLOGY INC99 citations98
US5885869AMar 23, 1999
Method for uniformly doping hemispherical grain polycrystalline silicon
MICRON TECHNOLOGY INC102 citations97
US6461982B2Oct 8, 2002
Methods for forming a dielectric film
MICRON TECHNOLOGY INC74 citations96
US6458645B2Oct 1, 2002
Capacitor having tantalum oxynitride film and method for making same
MICRON TECHNOLOGY INC41 citations96
US6380103B2Apr 30, 2002
Rapid thermal etch and rapid thermal oxidation
MICRON TECHNOLOGY INC47 citations96
US6291868B1Sep 18, 2001
Forming a conductive structure in a semiconductor device
MICRON TECHNOLOGY INC76 citations96
US6255159B1Jul 3, 2001
Method to form hemispherical grained polysilicon
MICRON TECHNOLOGY INC53 citations96
US6190992B1Feb 20, 2001
Method to achieve rough silicon surface on both sides of container for enhanced capacitance/area electrodes
MICRON TECHNOLOGY INC57 citations96
US6191443B1Feb 20, 2001
Capacitors, methods of forming capacitors, and DRAM memory cells
MICRON TECHNOLOGY INC52 citations96
US6180481B1Jan 30, 2001
Barrier layer fabrication methods
MICRON TECHNOLOGY INC54 citations96
US6165833ADec 26, 2000
Semiconductor processing method of forming a capacitor
MICRON TECHNOLOGY INC68 citations96
US6162744ADec 19, 2000
Method of forming capacitors having high-K oxygen containing capacitor dielectric layers, method of processing high-K oxygen containing dielectric layers, method of forming a DRAM cell having having high-K oxygen containing capacitor dielectric layers
MICRON TECHNOLOGY INC62 citations96
US6159828ADec 12, 2000
Semiconductor processing method of providing a doped polysilicon layer
MICRON TECHNOLOGY INC70 citations96
US6150706ANov 21, 2000
Capacitor/antifuse structure having a barrier-layer electrode and improved barrier layer
MICRON TECHNOLOGY INC34 citations96
US6146959ANov 14, 2000
Method of forming capacitors containing tantalum
MICRON TECHNOLOGY INC64 citations96
US6146967ANov 14, 2000
Selective deposition of amorphous silicon film seeded in a chlorine gas and a hydride gas ambient when forming a stacked capacitor with HSG
MICRON TECHNOLOGY INC36 citations96
US6090723AJul 18, 2000
Conditioning of dielectric materials
MICRON TECHNOLOGY INC70 citations96
US5994240ANov 30, 1999
Method for cleaning semiconductor wafers
MICRON TECHNOLOGY INC65 citations96
US5969983AOct 19, 1999
Capacitor/antifuse structure having a barrier-layer electrode and improved barrier layer
MICRON TECHNOLOGY INC38 citations96
US5930106AJul 27, 1999
DRAM capacitors made from silicon-germanium and electrode-limited conduction dielectric films
MICRON TECHNOLOGY INC51 citations96
US5913149AJun 15, 1999
Method for fabricating stacked layer silicon nitride for low leakage and high capacitance
MICRON TECHNOLOGY INC62 citations96
US5885896AMar 23, 1999
Using implants to lower anneal temperatures
MICRON TECHNOLOGY INC45 citations96
US5882979AMar 16, 1999
Method for forming controllable surface enhanced three dimensional objects
MICRON TECHNOLOGY INC45 citations96
US5869389AFeb 9, 1999
Semiconductor processing method of providing a doped polysilicon layer
MICRON TECHNOLOGY INC42 citations96
US5869405AFeb 9, 1999
In situ rapid thermal etch and rapid thermal oxidation
MICRON TECHNOLOGY INC48 citations96
US5863327AJan 26, 1999
Apparatus for forming materials
MICRON TECHNOLOGY INC36 citations96
US5825498AOct 20, 1998
Ultraviolet light reflectance method for evaluating the surface characteristics of opaque materials
MICRON TECHNOLOGY INC54 citations96
MICRON SEMICONDUCTOR INC
4 patentsUS5407534AApr 18, 1995
Method to prepare hemi-spherical grain (HSG) silicon using a fluorine based gas mixture and high vacuum anneal
MICRON SEMICONDUCTOR INC158 citations99
US5340765AAug 23, 1994
Method for forming enhanced capacitance stacked capacitor structures using hemi-spherical grain polysilicon
MICRON SEMICONDUCTOR INC252 citations99
US5382533AJan 17, 1995
Method of manufacturing small geometry MOS field-effect transistors having improved barrier layer to hot electron injection
MICRON SEMICONDUCTOR INC143 citations98
US5376593ADec 27, 1994
Method for fabricating stacked layer Si3 N4 for low leakage high capacitance films using rapid thermal nitridation
MICRON SEMICONDUCTOR INC116 citations98
STEAG RTP SYSTEMS INC
4 patentsUS6281141B1Aug 28, 2001
Process for forming thin dielectric layers in semiconductor devices
STEAG RTP SYSTEMS INC553 citations97
US6200023B1Mar 13, 2001
Method for determining the temperature in a thermal processing chamber
STEAG RTP SYSTEMS INC92 citations97
US6359263B2Mar 19, 2002
System for controlling the temperature of a reflective substrate during rapid heating
STEAG RTP SYSTEMS INC69 citations96
US6174651B1Jan 16, 2001
Method for depositing atomized materials onto a substrate utilizing light exposure for heating
STEAG RTP SYSTEMS INC75 citations96
APPLIED MATERIALS INC
2 patentsMICRON TECHNOLOGIES INC
1 patentMATTSON TECH INC
1 patent(unassigned)
1 patentShowing the top 50 of 254 patents by PatentIndex Score.