Inventor
CARSON FLYNN P
US15 patents
Patents
15 patentsUS9679801B2Jun 13, 2017
Dual molded stack TSV package
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US9721903B2Aug 1, 2017
Vertical interconnects for self shielded system in package (SiP) modules
APPLE INC31 citations92
US9589936B2Mar 7, 2017
3D integration of fanout wafer level packages
APPLE INC19 citations92
US10115677B2Oct 30, 2018
Vertical interconnects for self shielded system in package (SiP) modules
APPLE INC5 citations82
US9899239B2Feb 20, 2018
Carrier ultra thin substrate
APPLE INC6 citations72
US10631410B2Apr 21, 2020
Stacked printed circuit board packages
APPLE INC2 citations71
US10522475B2Dec 31, 2019
Vertical interconnects for self shielded system in package (SiP) modules
APPLE INC4 citations71
US12074077B2Aug 27, 2024
Flexible package architecture concept in fanout
APPLE INC2 citations70
US11395408B2Jul 19, 2022
Wafer-level passive array packaging
APPLE INC2 citations70
US10535611B2Jan 14, 2020
Substrate-less integrated components
APPLE INC1 citations61
US12165956B2Dec 10, 2024
Molded silicon on passive package
APPLE INC0 citations59
US10991659B2Apr 27, 2021
Substrate-less integrated components
APPLE INC0 citations57
US12107283B2Oct 1, 2024
Cell packaging techniques
APPLE INC0 citations54
US12266846B2Apr 1, 2025
System packaging for millimeter wave antennas
APPLE INC0 citations53
US10109593B2Oct 23, 2018
Self shielded system in package (SiP) modules
APPLE INC1 citations50