Inventor
MAHAJAN RAVINDRANATH VITHAL
US7 patents
Patents
7 patentsUS12392970B2Aug 19, 2025
Photonic integrated circuit packaging architectures
INTEL CORP2 citations73
US12148742B2Nov 19, 2024
Active bridge enabled co-packaged photonic transceiver
INTEL CORP6 citations72
US12525563B2Jan 13, 2026
Microelectronic assemblies including stacked dies coupled by a through dielectric via
INTEL CORP0 citations61
US12506127B2Dec 23, 2025
Package architecture of photonic system with vertically stacked dies having planarized edges
INTEL CORP0 citations61
US12181710B2Dec 31, 2024
Photonic integrated circuit packaging architecture
INTEL CORP0 citations61
US11417630B2Aug 16, 2022
Semiconductor package having passive support wafer
INTEL CORP1 citations56
US12506128B2Dec 23, 2025
Package architecture of scalable compute wall having compute bricks with vertically stacked dies
INTEL CORP0 citations50