Inventor

BEZAMA RASCHID J

US60 patents

⚠️ This page may combine multiple inventors who share the name “BEZAMA RASCHID J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BEZAMA RASCHID J

IBM

Method of forming a multilayer electronic packaging substrate with integral cooling channels

Microjet module assembly

Microjet module assembly

Method and apparatus to manufacture an electronic package with direct wiring pattern

Variable thermal exchanger and method thereof

Large ceramic article and method of manufacturing

High power microjet cooler

Metal/dielectric laminate with electrodes and process thereof

Method of making a self cooling electrically programmable fuse

Method of forming a thermally activated noise immune fuse

Self cooling electrically programmable fuse

Method for forming cavities without using an insert

Thermally activated noise immune fuse

High performance integrated MLC cooling device for high power density ICS and method for manufacturing

Spatial transformation interposer for electronic packaging

Punched slug removal system

Planar metallized substrate with embedded camber control material and method thereof

Pastes for improved substrate dimensional control

Non-contact fluid particle cleaner and method

High power microjet cooler

Electronic package with improved current carrying capability and method of forming the same

Method for punching slug from workpiece

Method of making a multilayer ceramic product with thin layers

Apparatus and method for forming isotropic multilayer ceramic substrates

Liquid cooled compliant heat sink and related method

Apparatus and method for reducing contamination in immersion lithography

Multi-level web structure in use for thin sheet processing

Solder interconnect with non-wettable sidewall pillars and methods of manufacture

Systems and methods for cooling an electronic device

Electronic package with improved current carrying capability and method of forming the same

Low strain chip removal apparatus

Substrate with ceramic coating for camber modification and method for making

Method of controlling the densification behavior of a metallic feature in a ceramic material

Gas-loaded pressure diaphragm

Fast firing flattening method and apparatus for sintered multilayer ceramic electronic substrates

Reducing contamination in immersion lithography

Reducing contamination in immersion lithography

Method of forming a plate for dispensing chemicals

Large ceramic articles and method of manufacturing

Liquid cooled compliant heat sink and related method

Rinsing and drying for electrochemical processing

ARVIN CHARLES L

Multi-anode system for uniform plating of alloys

Structures for improving current carrying capability of interconnects and methods of fabricating the same

Solder interconnect with non-wettable sidewall pillars and methods of manufacture

Rinsing and drying for electrochemical processing

Structures for improving current carrying capability of interconnects and methods of fabricating the same

Multi-anode system for uniform plating of alloys

Multi-anode system for uniform plating of alloys

BEZAMA RASCHID J

Method and structure to control thermal gradients in semiconductor wafers during rapid thermal processing

Structures and methods to reduce maximum current density in a solder ball