Inventor
BAYER HEINER
DE20 patents
⚠️ This page may combine multiple inventors who share the name “BAYER HEINER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SIEMENS AG
14 patentsUS5242715ASep 7, 1993
Process for coating or bonding electronic components and subassemblies
SIEMENS AG77 citations95
US5576357ANov 19, 1996
One-component reactive resin system comprising a cure-inhibiting glycidyl phosphorus compound
SIEMENS AG22 citations92
US4880662ANov 14, 1989
Method and apparatus for processing UV-hardenable reaction resin compounds
SIEMENS AG41 citations91
US6200408B1Mar 13, 2001
Method for cementing a component to a surface
SIEMENS AG16 citations83
US6150435ANov 21, 2000
One-component epoxy resin for covering electronic components
SIEMENS AG11 citations73
US4970399ANov 13, 1990
Method and apparatus for processing UV-hardenable reaction resin compounds
SIEMENS AG9 citations72
US5158990AOct 27, 1992
Coating compounds for electrical and electronic components containing vitreons fused silica
SIEMENS AG11 citations65
US6297344B1Oct 2, 2001
Heat-setting single-component LVA (low viscosity adhesive) system for bonding in the micro-range
SIEMENS AG5 citations63
US7851978B2Dec 14, 2010
Piezo actuator comprising a multilayer encapsulation, and method for the production thereof
SIEMENS AG4 citations62
US6160077ADec 12, 2000
Halogen-free epoxy resin
SIEMENS AG2 citations62
US6207732B1Mar 27, 2001
Heat-setting single-component LVA (low-viscosity adhesive) system for bonding in the micro-range
SIEMENS AG3 citations61
US5900286AMay 4, 1999
Method of producing an attenuating structure on a surface wave component
SIEMENS AG3 citations61
US5468786ANov 21, 1995
Radiation-curable reaction resin system
SIEMENS AG5 citations61
US5227219AJul 13, 1993
Surface wave components with an acoustically matched damping compound
SIEMENS AG3 citations60