Inventor
ROGALLI MICHAEL
DE16 patents
⚠️ This page may combine multiple inventors who share the name “ROGALLI MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
11 patentsUS6790737B2Sep 14, 2004
Method for fabricating thin metal layers from the liquid phase
INFINEON TECHNOLOGIES AG32 citations92
US6958256B2Oct 25, 2005
Process for the back-surface grinding of wafers
INFINEON TECHNOLOGIES AG12 citations83
US10103123B2Oct 16, 2018
Semiconductor devices and processing methods
INFINEON TECHNOLOGIES AG4 citations72
US9165821B2Oct 20, 2015
Method for providing a self-aligned pad protection in a semiconductor device
INFINEON TECHNOLOGIES AG4 citations72
US11424201B2Aug 23, 2022
Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device
INFINEON TECHNOLOGIES AG0 citations61
US12040288B2Jul 16, 2024
Chip package and method of forming a chip package
INFINEON TECHNOLOGIES AG0 citations59
US11735534B2Aug 22, 2023
Chip package and method of forming a chip package
INFINEON TECHNOLOGIES AG0 citations59
US9385031B2Jul 5, 2016
Method for providing a self-aligned pad protection in a semiconductor device
INFINEON TECHNOLOGIES AG0 citations51
US6380076B2Apr 30, 2002
Dielectric filling of electrical wiring planes
INFINEON TECHNOLOGIES AG1 citations51
US10446469B2Oct 15, 2019
Semiconductor device having a copper element and method of forming a semiconductor device having a copper element
INFINEON TECHNOLOGIES AG0 citations48
US7169716B2Jan 30, 2007
Photosensitive lacquer for providing a coating on a semiconductor substrate or a mask
INFINEON TECHNOLOGIES AG0 citations47
SIEMENS AG
4 patentsUS5917705AJun 29, 1999
Chip card
SIEMENS AG7 citations71
US5468786ANov 21, 1995
Radiation-curable reaction resin system
SIEMENS AG5 citations61
US5780103AJul 14, 1998
Method for forming of a silicon oxide layer on a topography
SIEMENS AG4 citations60
US5227219AJul 13, 1993
Surface wave components with an acoustically matched damping compound
SIEMENS AG3 citations60