P

Inventor

KUMAR ANANDA HOSAKERE

US8 patents
⚠️ This page may combine multiple inventors who share the name “KUMAR ANANDA HOSAKERE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SARNOFF CORP

4 patents
US5847935ADec 8, 1998

Electronic circuit chip package

SARNOFF CORP63 citations95
US6017642AJan 25, 2000

Low dielectric loss glasses

SARNOFF CORP32 citations92
US5958807ASep 28, 1999

Low dielectric loss glass ceramic compositions

SARNOFF CORP34 citations92
US5876536AMar 2, 1999

Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate

SARNOFF CORP20 citations92

SARNOFF DAVID RES CENTER

2 patents
US5681444AOct 28, 1997

Electrical feedthroughs for ceramic circuit board support substrates

SARNOFF DAVID RES CENTER13 citations70
US5653834AAug 5, 1997

Process for making electrical feedthroughs for ceramic circuit board support substrates

SARNOFF DAVID RES CENTER9 citations70

LAMINA CERAMICS INC

1 patent
US6709749B1Mar 23, 2004

Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate

LAMINA CERAMICS INC10 citations73

IBM

1 patent
US4971738ANov 20, 1990

Enhanced removal of carbon from ceramic substrate laminates

IBM16 citations73