Inventor
HU TIEN-CHEN
TW18 patents
⚠️ This page may combine multiple inventors who share the name “HU TIEN-CHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
14 patentsUS6517413B1Feb 11, 2003
Method for a copper CMP endpoint detection system
TAIWAN SEMICONDUCTOR MFG105 citations94
US6649077B2Nov 18, 2003
Method and apparatus for removing coating layers from alignment marks on a wafer
TAIWAN SEMICONDUCTOR MFG21 citations92
US6227947B1May 8, 2001
Apparatus and method for chemical mechanical polishing metal on a semiconductor wafer
TAIWAN SEMICONDUCTOR MFG35 citations92
US5929324AJul 27, 1999
Apparatus for detecting leakage in a gas reactor
TAIWAN SEMICONDUCTOR MFG34 citations88
US6315649B1Nov 13, 2001
Wafer mounting plate for a polishing apparatus and method of using
TAIWAN SEMICONDUCTOR MFG18 citations77
US6837774B2Jan 4, 2005
Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using
TAIWAN SEMICONDUCTOR MFG9 citations73
US6726532B2Apr 27, 2004
Belt tensioning assembly for CMP apparatus
TAIWAN SEMICONDUCTOR MFG15 citations73
US6524959B1Feb 25, 2003
Chemical mechanical polish (CMP) planarizing method employing derivative signal end-point monitoring and control
TAIWAN SEMICONDUCTOR MFG11 citations73
US6914337B2Jul 5, 2005
Calibration wafer and kit
TAIWAN SEMICONDUCTOR MFG9 citations66
US6561880B1May 13, 2003
Apparatus and method for cleaning the polishing pad of a linear polisher
TAIWAN SEMICONDUCTOR MFG5 citations58
US7014739B2Mar 21, 2006
Convex profile anode for electroplating system
TAIWAN SEMICONDUCTOR MFG5 citations52
US9281221B2Mar 8, 2016
Ultra-high vacuum (UHV) wafer processing
TAIWAN SEMICONDUCTOR MFG1 citations47
US7824243B2Nov 2, 2010
Chemical mechanical planarization methods
TAIWAN SEMICONDUCTOR MFG0 citations46
US7823241B2Nov 2, 2010
System for cleaning a wafer
TAIWAN SEMICONDUCTOR MFG0 citations33