Inventor
TSAI CHI-LONG
TW14 patents
Patents
14 patentsUS7253519B2Aug 7, 2007
Chip packaging structure having redistribution layer with recess
ADVANCED SEMICONDUCTOR ENG57 citations96
US7501311B2Mar 10, 2009
Fabrication method of a wafer structure
ADVANCED SEMICONDUCTOR ENG23 citations91
US6921716B2Jul 26, 2005
Wafer bumping process
ADVANCED SEMICONDUCTOR ENG16 citations84
US7473998B2Jan 6, 2009
Method for forming bump protective collars on a bumped wafer
ADVANCED SEMICONDUCTOR ENG10 citations83
US7129111B2Oct 31, 2006
Method for forming bump protective collars on a bumped wafer
ADVANCED SEMICONDUCTOR ENG12 citations83
US7432188B2Oct 7, 2008
Structure of bumps forming on an under metallurgy layer and method for making the same
ADVANCED SEMICONDUCTOR ENG12 citations76
US7015130B2Mar 21, 2006
Method for making UBM pads and bumps on wafer
ADVANCED SEMICONDUCTOR ENG9 citations69
US7105433B2Sep 12, 2006
Method for treating wafer surface
ADVANCED SEMICONDUCTOR ENG6 citations62
US7261828B2Aug 28, 2007
Bumping process
ADVANCED SEMICONDUCTOR ENG2 citations60
US12027469B2Jul 2, 2024
Electronic device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations57
US12183593B2Dec 31, 2024
Manufacturing method for manufacturing a package structure
ADVANCED SEMICONDUCTOR ENG0 citations55
US7041590B2May 9, 2006
Formation method for conductive bump
ADVANCED SEMICONDUCTOR ENG4 citations54
US11798859B2Oct 24, 2023
Electronic device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations45
US7402510B2Jul 22, 2008
Etchant and method for forming bumps
ADVANCED SEMICONDUCTOR ENG0 citations39