Inventor
CHENG KUO-HSIEN
TW11 patents
⚠️ This page may combine multiple inventors who share the name “CHENG KUO-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
8 patentsUS6017791AJan 25, 2000
Multi-layer silicon nitride deposition method for forming low oxidation temperature thermally oxidized silicon nitride/silicon oxide (no) layer
TAIWAN SEMICONDUCTOR MFG84 citations96
US6146991ANov 14, 2000
Barrier metal composite layer featuring a thin plasma vapor deposited titanium nitride capping layer
TAIWAN SEMICONDUCTOR MFG31 citations92
US5763303AJun 9, 1998
Rapid thermal chemical vapor deposition procedure for a self aligned, polycide contact structure
TAIWAN SEMICONDUCTOR MFG17 citations83
US6577926B1Jun 10, 2003
Method of detecting and controlling in-situ faults in rapid thermal processing systems
TAIWAN SEMICONDUCTOR MFG13 citations79
US6191035B1Feb 20, 2001
Recipe design to prevent tungsten (W) coating on wafer backside for those wafers with poly Si on wafer backside
TAIWAN SEMICONDUCTOR MFG13 citations71
US5923988AJul 13, 1999
Two step thermal treatment procedure applied to polycide structures deposited using dichlorosilane as a reactant
TAIWAN SEMICONDUCTOR MFG14 citations68
US6376156B1Apr 23, 2002
Prevent defocus issue on wafer with tungsten coating on back-side
TAIWAN SEMICONDUCTOR MFG2 citations62
US7205634B2Apr 17, 2007
MIM structure and fabrication process with improved capacitance reliability
TAIWAN SEMICONDUCTOR MFG4 citations59