Inventor
YOSHINO HIROAKI
JP24 patents
⚠️ This page may combine multiple inventors who share the name “YOSHINO HIROAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CANON KK
11 patentsUS7952620B2May 31, 2011
Image processing apparatus, image playing method, image pick-up apparatus, and program and storage medium for use in displaying image data
CANON KK23 citations92
US7525580B2Apr 28, 2009
Image processing apparatus, image playing method, image pick-up apparatus, and program and storage medium for use in displaying image data
CANON KK20 citations92
US7505074B2Mar 17, 2009
Image sensing apparatus and its control method
CANON KK21 citations92
US7847850B2Dec 7, 2010
Image displaying apparatus, image displaying method, and non-transitory computer-readable storage medium
CANON KK8 citations82
US7634158B2Dec 15, 2009
Image processing apparatus, control method therefor, computer program, and computer-readable storage medium
CANON KK7 citations73
US7949209B2May 24, 2011
Image processing apparatus, control method therefor, computer program, and computer-readable storage medium
CANON KK3 citations62
US7778429B2Aug 17, 2010
Audio processor, audio processing method, computer program, and computer readable storage medium
CANON KK2 citations62
US7756362B2Jul 13, 2010
Image processing apparatus, control method therefor, computer program, and computer-readable storage medium
CANON KK1 citations62
US7750968B2Jul 6, 2010
Image processing apparatus, image processing method, program, and storage medium
CANON KK2 citations62
US11348676B2May 31, 2022
Medical examination system control apparatus and control method therefor
CANON KK0 citations51
US7825979B2Nov 2, 2010
Display control apparatus and display control method
CANON KK0 citations51
SHINKAWA KK
7 patentsUS7621436B2Nov 24, 2009
Wire bonding method
SHINKAWA KK128 citations97
US10607959B2Mar 31, 2020
Discharge examination device, wire-bonding apparatus, and discharge examination method
SHINKAWA KK1 citations59
US12417997B2Sep 16, 2025
Wire bonding apparatus, method for manufacture of semiconductor device, and semiconductor device
SHINKAWA KK0 citations51
US12374563B2Jul 29, 2025
Semiconductor device manufacturing method
SHINKAWA KK0 citations51
US12107070B2Oct 1, 2024
Wire bonding apparatus and method for manufacturing semiconductor device
SHINKAWA KK0 citations51
US12107067B2Oct 1, 2024
Wire bonding device, wire cutting method and non-transitory computer-readable recording medium recording program
SHINKAWA KK0 citations51
US7910472B2Mar 22, 2011
Method of manufacturing semiconductor device
SHINKAWA KK0 citations51