Inventor
HONDA TAKUMI
JP21 patents
⚠️ This page may combine multiple inventors who share the name “HONDA TAKUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HENKEL CORP
8 patentsUS5646211AJul 8, 1997
Autodeposition coating composition
HENKEL CORP23 citations90
US5760112AJun 2, 1998
Water-borne autodepositing coating compositions
HENKEL CORP28 citations86
US6211283B1Apr 3, 2001
Electrically insulated metallic surfaces with interior corners and methods and compositions therefor
HENKEL CORP15 citations84
US5141575AAug 25, 1992
Surface treatment for zinciferous surfaces
HENKEL CORP21 citations81
US6033492AMar 7, 2000
Composition and process for autodeposition with modifying rinse of wet autodeposited coating film
HENKEL CORP9 citations70
US6395336B1May 28, 2002
Process for improving the corrosion resistance of a metal surface
HENKEL CORP7 citations65
US5688560ANov 18, 1997
Process for coating metal surfaces
HENKEL CORP4 citations59
US5510410AApr 23, 1996
Autodeposition coating composition
HENKEL CORP2 citations59
TOKYO ELECTRON LTD
8 patentsUS11232959B2Jan 25, 2022
Substrate processing apparatus and substrate processing meihod
TOKYO ELECTRON LTD4 citations69
US12516242B2Jan 6, 2026
Substrate processing apparatus and substrate processing method
TOKYO ELECTRON LTD0 citations62
US11626294B2Apr 11, 2023
Substrate processing method, substrate processing apparatus and recording medium
TOKYO ELECTRON LTD0 citations61
US11915947B2Feb 27, 2024
Substrate processing apparatus and substrate processing method
TOKYO ELECTRON LTD0 citations59
US10840081B2Nov 17, 2020
Liquid processing apparatus, liquid processing method, and storage medium
TOKYO ELECTRON LTD1 citations56
US11948804B2Apr 2, 2024
Substrate processing method and substrate processing apparatus
TOKYO ELECTRON LTD0 citations51
US12033872B2Jul 9, 2024
Substrate processing apparatus and substrate processing method
TOKYO ELECTRON LTD0 citations50
US11972958B2Apr 30, 2024
Substrate processing apparatus and substrate processing method
TOKYO ELECTRON LTD0 citations48