Inventor
NARWANKAR PRAVIN
US17 patents
⚠️ This page may combine multiple inventors who share the name “NARWANKAR PRAVIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
15 patentsUS6217658B1Apr 17, 2001
Sequencing of the recipe steps for the optimal low-dielectric constant HDP-CVD Processing
APPLIED MATERIALS INC886 citations98
US6136685AOct 24, 2000
High deposition rate recipe for low dielectric constant films
APPLIED MATERIALS INC343 citations98
US5937323AAug 10, 1999
Sequencing of the recipe steps for the optimal low-k HDP-CVD processing
APPLIED MATERIALS INC935 citations98
US6548368B1Apr 15, 2003
Method of forming a MIS capacitor
APPLIED MATERIALS INC84 citations97
US6200911B1Mar 13, 2001
Method and apparatus for modifying the profile of narrow, high-aspect-ratio gaps using differential plasma power
APPLIED MATERIALS INC57 citations95
US5976993ANov 2, 1999
Method for reducing the intrinsic stress of high density plasma films
APPLIED MATERIALS INC53 citations95
US6579811B2Jun 17, 2003
Method and apparatus for modifying the profile of narrow, high-aspect-ratio gaps through wafer heating
APPLIED MATERIALS INC19 citations92
US6518203B2Feb 11, 2003
Method and apparatus for integrating a metal nitride film in a semiconductor device
APPLIED MATERIALS INC18 citations92
US6337289B1Jan 8, 2002
Method and apparatus for integrating a metal nitride film in a semiconductor device
APPLIED MATERIALS INC38 citations92
US5811356ASep 22, 1998
Reduction in mobile ion and metal contamination by varying season time and bias RF power during chamber cleaning
APPLIED MATERIALS INC48 citations92
US8343279B2Jan 1, 2013
Apparatuses for atomic layer deposition
APPLIED MATERIALS INC26 citations90
US6677254B2Jan 13, 2004
Processes for making a barrier between a dielectric and a conductor and products produced therefrom
APPLIED MATERIALS INC46 citations90
US6617266B2Sep 9, 2003
Barium strontium titanate annealing process
APPLIED MATERIALS INC13 citations79
US6534360B2Mar 18, 2003
Process for depositing layers on a semiconductor wafer
APPLIED MATERIALS INC10 citations74
US7294205B1Nov 13, 2007
Method for reducing the intrinsic stress of high density plasma films
APPLIED MATERIALS INC8 citations72