Inventor

FUJISAWA TOYOHIKO

JP17 patents

⚠️ This page may combine multiple inventors who share the name “FUJISAWA TOYOHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJISAWA TOYOHIKO

DOW CORNING TORAY CO LTD

Display device, method of manufacturing thereof, and method of improving visibility

Microparticles and curable organopolysiloxane composition containing the same

Adhesion promoter and curable organopolysiloxane composition containing same

Curable organopolysiloxane composition, semiconductor sealant comprising same, and semiconductor device

Curable silicone composition and cured product thereof

Curable organopolysiloxane composition, and protective-agent or adhesive-agent composition for electrical/electronic components

Insulating liquid die-bonding agent and semiconductor device

DOW TORAY CO LTD

Multicomponent-curable thermally-conductive silicone gel composition, thermally-conductive member and heat dissipation structure

Liquid curable silicone adhesive composition, cured product thereof, and use thereof

Thermally conductive silicone compound

Curable organopolysiloxane composition and a protectant or adhesive composition of electric/electronic parts

DOW CORNING TORAY SILICONE

Adhesive sheet of cross-linked silicone, method of manufacturing thereof, and device

Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device

DOW CORNING

Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducers

TANIGUCHI YOSHINORI

Organosilicon compound, method for producing thereof, and curable silicone composition containing the same

DOW SILICONES CORP

Curable organopolysiloxane composition, cured product, and electric/electronic equipment

FUJISAWA TOYOHIKO

Hot-melt silicone adhesive