Inventor
JIA RENHE
US18 patents
⚠️ This page may combine multiple inventors who share the name “JIA RENHE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CABOT MICROELECTRONICS CORP
10 patentsUS9505952B2Nov 29, 2016
Polishing composition containing ceria abrasive
CABOT MICROELECTRONICS CORP14 citations80
US8906252B1Dec 9, 2014
CMP compositions selective for oxide and nitride with high removal rate and low defectivity
CABOT MICROELECTRONICS CORP4 citations72
US9434859B2Sep 6, 2016
Chemical-mechanical planarization of polymer films
CABOT MICROELECTRONICS CORP3 citations71
US9422455B2Aug 23, 2016
CMP compositions exhibiting reduced dishing in STI wafer polishing
CABOT MICROELECTRONICS CORP3 citations68
US9165489B2Oct 20, 2015
CMP compositions selective for oxide over polysilicon and nitride with high removal rate and low defectivity
CABOT MICROELECTRONICS CORP2 citations60
US10414947B2Sep 17, 2019
Polishing composition containing ceria particles and method of use
CABOT MICROELECTRONICS CORP0 citations50
US9828528B2Nov 28, 2017
Polishing composition containing ceria abrasive
CABOT MICROELECTRONICS CORP0 citations48
US9850402B2Dec 26, 2017
CMP compositions and methods for selective removal of silicon nitride
CABOT MICROELECTRONICS CORP1 citations42
US9758697B2Sep 12, 2017
Polishing composition containing cationic polymer additive
CABOT MICROELECTRONICS CORP0 citations38
US9340706B2May 17, 2016
Mixed abrasive polishing compositions
CABOT MICROELECTRONICS CORP0 citations36
APPLIED MATERIALS INC
7 patentsUS7390744B2Jun 24, 2008
Method and composition for polishing a substrate
APPLIED MATERIALS INC17 citations84
US7582564B2Sep 1, 2009
Process and composition for conductive material removal by electrochemical mechanical polishing
APPLIED MATERIALS INC9 citations83
US7210988B2May 1, 2007
Method and apparatus for reduced wear polishing pad conditioning
APPLIED MATERIALS INC9 citations72
US7344432B2Mar 18, 2008
Conductive pad with ion exchange membrane for electrochemical mechanical polishing
APPLIED MATERIALS INC3 citations60
US7576007B2Aug 18, 2009
Method for electrochemically mechanically polishing a conductive material on a substrate
APPLIED MATERIALS INC0 citations52
US7504018B2Mar 17, 2009
Electrochemical method for Ecmp polishing pad conditioning
APPLIED MATERIALS INC1 citations51
US7879255B2Feb 1, 2011
Method and composition for electrochemically polishing a conductive material on a substrate
APPLIED MATERIALS INC1 citations50