Inventor

TAKUBO CHIAKI

JP63 patents

⚠️ This page may combine multiple inventors who share the name “TAKUBO CHIAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAKUBO CHIAKI

TOSHIBA KK

Flip-chip connection type semiconductor integrated circuit device

Display device having driving circuits at the periphery of a substrate

Semiconductor assembly having laminated semiconductor devices

Stacked type semiconductor device

Flip chip mounting type semiconductor device

Ball grid array type package for semiconductor device

Tape carrier and assembly structure thereof

Semiconductor device having a bump electrode connected to an inner lead

Semiconductor device, method of fabricating the same and copper leads

Semiconductor device comprising fine bump electrode having small side etch portion and stable characteristics

Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring board

Semiconductor device and BGA package

Semiconductor device and manufacturing method therefor

Semiconductor device, semiconductor package member, and semiconductor device manufacturing method

Board for evaluating the characteristics of a semiconductor chip and a method for mounting a semiconductor chip thereon

Semiconductor device using gold bumps and copper leads as bonding elements

Method of manufacturing a semiconductor device

Semiconductor assembly having laminated semiconductor devices

IC package for high-speed semiconductor integrated circuit device

Semiconductor integrated circuit apparatus

IC packing device with impedance adjusting insulative layer

Semiconductor integrated circuit device particularly for high speed logic operations

Semiconductor device using film carrier

Lead carrier

Semiconductor device

Semiconductor device and manufacturing method therefor

Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuit

Semiconductor device package having a semiconductor element with resin

Semiconductor device and method of manufacturing the same

Ic packing device

Timing controller for high-speed digital integrated circuit

Method of manufacturing an electronic circuit formed on a substrate

Semiconductor device having power semiconductor elements

Optical semiconductor module and semiconductor device including the same

Contact sheet for testing electronic parts, apparatus for testing electronic parts, method for testing electronic parts, method for manufacturing electronic parts and electronic parts

Apparatus and method for inspecting an LSI device in an assembling process, capable of detecting connection failure of individual flexible leads

Solid state imaging device and method for manufacturing same, and solid state imaging module

Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface

Laminated-chip semiconductor device

Semiconductor device

Semiconductor device

SHINKO ELECTRIC IND CO

Multi-layer circuit board

Multi-layer circuit board with particular pad spacing

Circuit pattern for multi-layer circuit board for mounting electronic parts

TANIDA KAZUMASA

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module

Semiconductor device and method for manufacturing the same

Semiconductor device, through hole having expansion portion and thin insulating film

SUMITOMO ELECTRIC INDUSTRIES

Method for manufacturing optical coupling part and optical coupling part

Lead frame, optical coupling part using lead frame, and manufacturing method of optical coupling part

KABSUSHIKI KAISHA TOSHIBA

Image forming apparatus and method of manufacturing electronic circuit using the same