Inventor

BERDY DAVID FRANCIS

US49 patents

⚠️ This page may combine multiple inventors who share the name “BERDY DAVID FRANCIS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BERDY DAVID FRANCIS

QUALCOMM INC

Density-optimized module-level inductor ground structure

Skewed co-spiral inductor structure

Compartment shielding in flip-chip (FC) module

Passive-on-glass (POG) device and method

Backside coupled symmetric varactor structure

Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)

Backside coupled symmetric varactor structure

Substrate comprising an embedded inductor and a thin film magnetic core

Interposer device including at least one transistor and at least one through-substrate via

Backside ground plane for integrated circuit

Encapsulation of acoustic resonator devices

Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications

Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications

Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter

Passive device assembly for accurate ground plane control

MIM capacitor and method of making the same

Integrated circuits (ICS) on a glass substrate

Varactor device with backside contact

Superposed structure 3D orthogonal through substrate inductor

Frequency multiplexer

Hybrid passive-on-glass (POG) acoustic filter

Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductor

Stacked substrate inductor

Integrated circuits (ICs) on a glass substrate

System and method to reduce unwanted receive signal leakage during switching

High performance inductors

Passive-on-glass (POG) device and method

Two-dimensional structure to form an embedded three-dimensional structure

Land grid array (LGA) packaging of passive-on-glass (POG) structure

Solenoid inductor

Integrated circuits (ICs) on a glass substrate

Tunable matching network

Passive device assembly for accurate ground plane control

Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance

Passive components implemented on a plurality of stacked insulators

Double-sided circuit

Open-passivation ball grid array pads

Wafer level package (WLP) ball support using cavity structure

Apparatus with 3D wirewound inductor integrated within a substrate

LC filter layer stacking by layer transfer to make 3D multiplexer structures

Side-assembled passive devices

Superposed structure 3D orthogonal through substrate inductor

Devices and methods to reduce stress in an electronic device

Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package

Dynamic radio frequency loading change mitigation

Vertical spiral inductor

Stress mitigation structure for wafer warpage reduction

Semiconductor assembly and method of making same

QUALCOMM MEMS TECHNOLOGIES INC

Compact 3-D coplanar transmission lines