Inventor
SAKAI TAKEKAZU
JP14 patents
⚠️ This page may combine multiple inventors who share the name “SAKAI TAKEKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHOWA DENKO KK
8 patentsUS5556023ASep 17, 1996
Method of forming solder film
SHOWA DENKO KK40 citations96
US5982629ANov 9, 1999
Silicon semiconductor device,electrode structure therefor, and circuit board mounted therewith
SHOWA DENKO KK37 citations92
US6476487B2Nov 5, 2002
Solder circuit
SHOWA DENKO KK16 citations84
US6221692B1Apr 24, 2001
Method of fabricating solder-bearing silicon semiconductor device and circuit board mounted therewith
SHOWA DENKO KK15 citations84
US5928440AJul 27, 1999
Method of forming solder film
SHOWA DENKO KK14 citations82
US5750271AMay 12, 1998
Method of forming solder film
SHOWA DENKO KK13 citations82
US5713997AFeb 3, 1998
Solution for selectively imparting tackiness to a metallic surface
SHOWA DENKO KK16 citations82
US8038051B2Oct 18, 2011
Method for production of electronic circuit board
SHOWA DENKO KK0 citations52
SHOJI TAKASHI
5 patentsUS9078382B2Jul 7, 2015
Method of producing circuit board
SHOJI TAKASHI3 citations61
US8752754B2Jun 17, 2014
Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board
SHOJI TAKASHI1 citations51
US8661659B2Mar 4, 2014
Method of producing circuit board
SHOJI TAKASHI1 citations51
US8123111B2Feb 28, 2012
Production method of solder circuit board
SHOJI TAKASHI0 citations50
US8109432B2Feb 7, 2012
Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
SHOJI TAKASHI0 citations50