Inventor
CHUNG CHIN-LUNG
TW10 patents
Patents
10 patentsUS11605558B2Mar 14, 2023
Integrated circuit interconnect structure having discontinuous barrier layer and air gap
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11682616B2Jun 20, 2023
Semiconductor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US12300599B2May 13, 2025
Method for forming semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12550699B2Feb 10, 2026
Integrated circuit interconnect structure having discontinuous barrier layer and air gap
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11978663B2May 7, 2024
Integrated circuit interconnect structure having discontinuous barrier layer and air gap
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12347776B2Jul 1, 2025
Integrated chip with graphene based interconnect
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12218060B2Feb 4, 2025
Integrated chip with graphene based interconnect
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11948837B2Apr 2, 2024
Semiconductor structure having vertical conductive graphene and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11114374B2Sep 7, 2021
Graphene enabled selective barrier layer formation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12051643B2Jul 30, 2024
Hybrid via interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51