Inventor
NAKAZONO HAJIME
JP6 patents
Patents
6 patentsUS11510349B2Nov 22, 2022
Shield package and method of manufacturing shield package
TATSUTA ELECTRIC WIRE & CABLE CO LTD3 citations71
US12016165B2Jun 18, 2024
Shield package
TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations59
US11912897B2Feb 27, 2024
Electroconductive coating material and method for producing shielded package using said electroconductive coating material
TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations58
US11191198B2Nov 30, 2021
Shield package
TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations50
US11834586B2Dec 5, 2023
Conductive paint, method for producing shield package using the same, and method for producing resin molded article having shield layer
TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations49
US10153066B2Dec 11, 2018
Conductive paste and multilayer board using the same
TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations48