Inventor
JUNG JOO HWAN
KR17 patents
⚠️ This page may combine multiple inventors who share the name “JUNG JOO HWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
12 patentsUS9875970B2Jan 23, 2018
Fan-out semiconductor package
SAMSUNG ELECTRO MECH46 citations96
US10026678B1Jul 17, 2018
Fan-out semiconductor package
SAMSUNG ELECTRO MECH8 citations83
US10242973B2Mar 26, 2019
Fan-out-semiconductor package module
SAMSUNG ELECTRO MECH4 citations73
US9420709B2Aug 16, 2016
Coreless board for semiconductor package, method of manufacturing the same, and method of manufacturing semiconductor package using the same
SAMSUNG ELECTRO MECH3 citations72
US10153235B2Dec 11, 2018
Image sensor device and image sensor module comprising the same
SAMSUNG ELECTRO MECH3 citations71
US11758655B2Sep 12, 2023
Printed circuit board
SAMSUNG ELECTRO MECH1 citations62
US11576261B2Feb 7, 2023
Connection structure embedded substrate
SAMSUNG ELECTRO MECH1 citations62
US10283439B2May 7, 2019
Fan-out semiconductor package including electromagnetic interference shielding layer
SAMSUNG ELECTRO MECH1 citations62
US11751335B2Sep 5, 2023
Printed circuit board
SAMSUNG ELECTRO MECH0 citations57
US11521922B2Dec 6, 2022
Printed circuit board
SAMSUNG ELECTRO MECH0 citations52
US12336098B2Jun 17, 2025
Printed circuit board
SAMSUNG ELECTRO MECH0 citations51
US10199329B2Feb 5, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH0 citations51
SAMSUNG ELECTRONICS CO LTD
5 patentsUS10833040B2Nov 10, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US11532572B2Dec 20, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11075175B2Jul 27, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations61
US10403562B2Sep 3, 2019
Fan-out semiconductor package module
SAMSUNG ELECTRONICS CO LTD1 citations61
US10833070B2Nov 10, 2020
Fan-out semiconductor package module
SAMSUNG ELECTRONICS CO LTD0 citations40