Inventor
LEE SU CHANG
KR13 patents
⚠️ This page may combine multiple inventors who share the name “LEE SU CHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
11 patentsUS7868443B2Jan 11, 2011
Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability
SAMSUNG ELECTRONICS CO LTD11 citations84
US10651133B2May 12, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD8 citations83
US9048168B2Jun 2, 2015
Semiconductor packages having warpage compensation
SAMSUNG ELECTRONICS CO LTD7 citations83
US8716872B2May 6, 2014
Stacked semiconductor package including connections electrically connecting first and second semiconductor packages
SAMSUNG ELECTRONICS CO LTD8 citations83
US9698088B2Jul 4, 2017
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD11 citations82
US7615415B2Nov 10, 2009
Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability
SAMSUNG ELECTRONICS CO LTD7 citations73
US11646275B2May 9, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US11088091B2Aug 10, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations72
US9040351B2May 26, 2015
Stack packages having fastening element and halogen-free inter-package connector
SAMSUNG ELECTRONICS CO LTD4 citations72
US12132009B2Oct 29, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US9601458B2Mar 21, 2017
Stacked semiconductor package including connections electrically connecting first and second semiconductor packages
SAMSUNG ELECTRONICS CO LTD1 citations51
KWON HEUNG-KYU
2 patentsUS8604614B2Dec 10, 2013
Semiconductor packages having warpage compensation
KWON HEUNG-KYU19 citations92
US8546954B2Oct 1, 2013
Stacked semiconductor package having electrical connections or varying heights between substrates, and semiconductor device including the stacked semiconductor package
KWON HEUNG-KYU13 citations83