Inventor
SACHDEV KRISHNA G
US67 patents
⚠️ This page may combine multiple inventors who share the name “SACHDEV KRISHNA G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
49 patentsUS6528145B1Mar 4, 2003
Polymer and ceramic composite electronic substrates
IBM208 citations98
US6525009B2Feb 25, 2003
Polycarboxylates-based aqueous compositions for cleaning of screening apparatus
IBM99 citations97
US5470693ANov 28, 1995
Method of forming patterned polyimide films
IBM140 citations97
US6569252B1May 27, 2003
Semi-aqueous solvent cleaning of paste processing residue from substrates
IBM44 citations96
US6262390B1Jul 17, 2001
Repair process for aluminum nitride substrates
IBM66 citations96
US5532608AJul 2, 1996
Ceramic probe card and method for reducing leakage current
IBM72 citations96
US5114826AMay 19, 1992
Photosensitive polyimide compositions
IBM98 citations96
US4692205ASep 8, 1987
Silicon-containing polyimides as oxygen etch stop and dual dielectric coatings
IBM149 citations96
US4599243AJul 8, 1986
Use of plasma polymerized organosilicon films in fabrication of lift-off masks
IBM73 citations96
US4562091ADec 31, 1985
Use of plasma polymerized orgaosilicon films in fabrication of lift-off masks
IBM55 citations96
US4549824AOct 29, 1985
Ink additives for efficient thermal ink transfer printing processes
IBM66 citations96
US4519872AMay 28, 1985
Use of depolymerizable polymers in the fabrication of lift-off structure for multilevel metal processes
IBM64 citations96
US6682872B2Jan 27, 2004
UV-curable compositions and method of use thereof in microelectronics
IBM90 citations95
US5888308AMar 30, 1999
Process for removing residue from screening masks with alkaline solution
IBM53 citations95
US5231751AAug 3, 1993
Process for thin film interconnect
IBM166 citations95
US4772346ASep 20, 1988
Method of bonding inorganic particulate material
IBM65 citations94
US5591789AJan 7, 1997
Polyester dispersants for high thermal conductivity paste
IBM50 citations93
US5310863AMay 10, 1994
Polyimide materials with improved physico-chemical properties
IBM46 citations93
US4493855AJan 15, 1985
Use of plasma polymerized organosilicon films in fabrication of lift-off masks
IBM48 citations93
US6652665B1Nov 25, 2003
Method of removing silicone polymer deposits from electronic components
IBM43 citations92
US6277799B1Aug 21, 2001
Aqueous cleaning of paste residue
IBM33 citations92
US5938856AAug 17, 1999
Process of removing flux residue from microelectronic components
IBM39 citations92
US5700581ADec 23, 1997
Solvent-free epoxy based adhesives for semiconductor chip attachment and process
IBM39 citations92
US5422223AJun 6, 1995
Silicon-containing positive resist and use in multilayer metal structures
IBM50 citations92
US5399462AMar 21, 1995
Method of forming sub-half micron patterns with optical lithography using bilayer resist compositions comprising a photosensitive polysilsesquioxane
IBM33 citations92
US6406778B1Jun 18, 2002
Multi-thickness, multi-layer green sheet lamination and method thereof
IBM18 citations91
US6280527B1Aug 28, 2001
Aqueous quaternary ammonium hydroxide as a screening mask cleaner
IBM27 citations91
US6245171B1Jun 12, 2001
Multi-thickness, multi-layer green sheet lamination and method thereof
IBM22 citations91
US6032683AMar 7, 2000
System for cleaning residual paste from a mask
IBM19 citations91
US5916374AJun 29, 1999
Optimized in-line mask cleaning system
IBM24 citations91
US5374503ADec 20, 1994
Method of forming patterned polyimide films
IBM36 citations91
US7405247B2Jul 29, 2008
Conductive adhesive composition
IBM26 citations90
US7312261B2Dec 25, 2007
Thermal interface adhesive and rework
IBM24 citations90
US6548175B2Apr 15, 2003
Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
IBM48 citations90
US4826564AMay 2, 1989
Method of selective reactive ion etching of substrates
IBM33 citations90
US5303862AApr 19, 1994
Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures
IBM24 citations89
US6261927B1Jul 17, 2001
Method of forming defect-free ceramic structures using thermally depolymerizable surface layer
IBM16 citations84
US7393419B2Jul 1, 2008
Conductive adhesive rework method
IBM14 citations82
US6351871B1Mar 5, 2002
Aqueous quaternary ammonium hydroxide as a screening mask cleaner
IBM14 citations82
US4665006AMay 12, 1987
Positive resist system having high resistance to oxygen reactive ion etching
IBM21 citations82
US4617579AOct 14, 1986
Hydrophilic protective coatings for electroerosion printing
IBM23 citations82
US7329439B2Feb 12, 2008
UV-curable solvent free compositions and use thereof in ceramic chip defect repair
IBM15 citations80
US4525722AJun 25, 1985
Chemical heat amplification in thermal transfer printing
IBM25 citations79
US4894279AJan 16, 1990
Electroerosion print media having protective coatings modified with organotitanium reagents
IBM13 citations74
US4678701AJul 7, 1987
Resistive printing ribbon having improved properties
IBM10 citations74
US4596733AJun 24, 1986
Electroerosion recording material with polyorganosiloxane overlayer
IBM17 citations74
US4567490AJan 28, 1986
Electroerosion recording medium of improved lubricity
IBM11 citations74
US4554562ANov 19, 1985
Scratch resistant recording materials for electroerosion printing not requiring a lubricant overcoat
IBM15 citations74
US6597058B1Jul 22, 2003
Method of forming defect-free ceramic structures using thermally depolymerizable surface layer
IBM12 citations73
SACHDEV KRISHNA G
1 patentShowing the top 50 of 67 patents by PatentIndex Score.