P

Inventor

SACHDEV KRISHNA G

US67 patents
⚠️ This page may combine multiple inventors who share the name “SACHDEV KRISHNA G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

49 patents
US6528145B1Mar 4, 2003

Polymer and ceramic composite electronic substrates

IBM208 citations98
US6525009B2Feb 25, 2003

Polycarboxylates-based aqueous compositions for cleaning of screening apparatus

IBM99 citations97
US5470693ANov 28, 1995

Method of forming patterned polyimide films

IBM140 citations97
US6569252B1May 27, 2003

Semi-aqueous solvent cleaning of paste processing residue from substrates

IBM44 citations96
US6262390B1Jul 17, 2001

Repair process for aluminum nitride substrates

IBM66 citations96
US5532608AJul 2, 1996

Ceramic probe card and method for reducing leakage current

IBM72 citations96
US5114826AMay 19, 1992

Photosensitive polyimide compositions

IBM98 citations96
US4692205ASep 8, 1987

Silicon-containing polyimides as oxygen etch stop and dual dielectric coatings

IBM149 citations96
US4599243AJul 8, 1986

Use of plasma polymerized organosilicon films in fabrication of lift-off masks

IBM73 citations96
US4562091ADec 31, 1985

Use of plasma polymerized orgaosilicon films in fabrication of lift-off masks

IBM55 citations96
US4549824AOct 29, 1985

Ink additives for efficient thermal ink transfer printing processes

IBM66 citations96
US4519872AMay 28, 1985

Use of depolymerizable polymers in the fabrication of lift-off structure for multilevel metal processes

IBM64 citations96
US6682872B2Jan 27, 2004

UV-curable compositions and method of use thereof in microelectronics

IBM90 citations95
US5888308AMar 30, 1999

Process for removing residue from screening masks with alkaline solution

IBM53 citations95
US5231751AAug 3, 1993

Process for thin film interconnect

IBM166 citations95
US4772346ASep 20, 1988

Method of bonding inorganic particulate material

IBM65 citations94
US5591789AJan 7, 1997

Polyester dispersants for high thermal conductivity paste

IBM50 citations93
US5310863AMay 10, 1994

Polyimide materials with improved physico-chemical properties

IBM46 citations93
US4493855AJan 15, 1985

Use of plasma polymerized organosilicon films in fabrication of lift-off masks

IBM48 citations93
US6652665B1Nov 25, 2003

Method of removing silicone polymer deposits from electronic components

IBM43 citations92
US6277799B1Aug 21, 2001

Aqueous cleaning of paste residue

IBM33 citations92
US5938856AAug 17, 1999

Process of removing flux residue from microelectronic components

IBM39 citations92
US5700581ADec 23, 1997

Solvent-free epoxy based adhesives for semiconductor chip attachment and process

IBM39 citations92
US5422223AJun 6, 1995

Silicon-containing positive resist and use in multilayer metal structures

IBM50 citations92
US5399462AMar 21, 1995

Method of forming sub-half micron patterns with optical lithography using bilayer resist compositions comprising a photosensitive polysilsesquioxane

IBM33 citations92
US6406778B1Jun 18, 2002

Multi-thickness, multi-layer green sheet lamination and method thereof

IBM18 citations91
US6280527B1Aug 28, 2001

Aqueous quaternary ammonium hydroxide as a screening mask cleaner

IBM27 citations91
US6245171B1Jun 12, 2001

Multi-thickness, multi-layer green sheet lamination and method thereof

IBM22 citations91
US6032683AMar 7, 2000

System for cleaning residual paste from a mask

IBM19 citations91
US5916374AJun 29, 1999

Optimized in-line mask cleaning system

IBM24 citations91
US5374503ADec 20, 1994

Method of forming patterned polyimide films

IBM36 citations91
US7405247B2Jul 29, 2008

Conductive adhesive composition

IBM26 citations90
US7312261B2Dec 25, 2007

Thermal interface adhesive and rework

IBM24 citations90
US6548175B2Apr 15, 2003

Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof

IBM48 citations90
US4826564AMay 2, 1989

Method of selective reactive ion etching of substrates

IBM33 citations90
US5303862AApr 19, 1994

Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures

IBM24 citations89
US6261927B1Jul 17, 2001

Method of forming defect-free ceramic structures using thermally depolymerizable surface layer

IBM16 citations84
US7393419B2Jul 1, 2008

Conductive adhesive rework method

IBM14 citations82
US6351871B1Mar 5, 2002

Aqueous quaternary ammonium hydroxide as a screening mask cleaner

IBM14 citations82
US4665006AMay 12, 1987

Positive resist system having high resistance to oxygen reactive ion etching

IBM21 citations82
US4617579AOct 14, 1986

Hydrophilic protective coatings for electroerosion printing

IBM23 citations82
US7329439B2Feb 12, 2008

UV-curable solvent free compositions and use thereof in ceramic chip defect repair

IBM15 citations80
US4525722AJun 25, 1985

Chemical heat amplification in thermal transfer printing

IBM25 citations79
US4894279AJan 16, 1990

Electroerosion print media having protective coatings modified with organotitanium reagents

IBM13 citations74
US4678701AJul 7, 1987

Resistive printing ribbon having improved properties

IBM10 citations74
US4596733AJun 24, 1986

Electroerosion recording material with polyorganosiloxane overlayer

IBM17 citations74
US4567490AJan 28, 1986

Electroerosion recording medium of improved lubricity

IBM11 citations74
US4554562ANov 19, 1985

Scratch resistant recording materials for electroerosion printing not requiring a lubricant overcoat

IBM15 citations74
US6597058B1Jul 22, 2003

Method of forming defect-free ceramic structures using thermally depolymerizable surface layer

IBM12 citations73

SACHDEV KRISHNA G

1 patent

Showing the top 50 of 67 patents by PatentIndex Score.