Inventor

KNICKERBOCKER JOHN U

US230 patents

⚠️ This page may combine multiple inventors who share the name “KNICKERBOCKER JOHN U”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KNICKERBOCKER JOHN U

IBM

Physically highly secure multi-chip assembly

Rolling ball connector

Password control via the web

Chip handling and electronic component integration

3D silicon-silicon die stack structure and method for fine pitch interconnection and vertical heat transport

Electronic package with a thermal interposer and method of manufacturing the same

Physically highly secure multi-chip assembly

Z-axis compressible polymer with fine metal matrix suspension

Rolling ball connector

Web internet screen customizing system

Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof

Removing a filled-out form from a non-interactive web browser cache to an interactive web browser cache

Underfill preform interposer for joining chip to substrate

Structure for a thin film multilayer capacitor

Method and means for co-sintering ceramic/metal mlc substrates

Multi-cavity substrate structure for discrete devices

Ceramic substrate having a sealed layer

Process for removing residue from screening masks with alkaline solution

Three-dimensional silicon interposer for low voltage low power systems

Process for forming cone shaped solder for chip interconnection

Large ceramic article and method of manufacturing

Conductive adhesive for thinned silicon wafers with through silicon vias

Chip system architecture for performance enhancement, power reduction and cost reduction

Techniques for providing decoupling capacitance

Greensheet carriers and processing thereof

Metal/dielectric laminate with electrodes and process thereof

Thermally efficient semiconductor chip

Method for forming cavities without using an insert

Via and trench filling using injection molded soldering

Advanced handler wafer bonding and debonding

Global vacuum injection molded solder system and method

Techniques for forming interconnects

Redundant configurable VCSEL laser array optical light source

Optical backplane array connector

Ceramic structure using a support sheet

Process of forming a ceramic structure using a support sheet

Decoupling capacitor method and structure using metal based carrier

Powdered metallic sheet method for deposition of substrate conductors

Gang punch tool assembly

Pre-patterned substrate layers for being personalized as needed

Thin film capacitor on ceramic

Gang punch tool assembly

Structure and process for making substrate packages for high frequency application

Aqueous cleaning of paste residue

Multi-cavity substrate structure for discrete devices

Low-cost high-density gang punch

Process and apparatus to remove closely spaced chips on a multi-chip module

Method for a thin film multilayer capacitor

ANDRY PAUL S

Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

KNICKERBOCKER JOHN U

Semiconductor device and method of making semiconductor device