Inventor
POMERANTZ GLENN A
US23 patents
Patents
23 patentsUS5870823AFeb 16, 1999
Method of forming a multilayer electronic packaging substrate with integral cooling channels
IBM229 citations99
US6525009B2Feb 25, 2003
Polycarboxylates-based aqueous compositions for cleaning of screening apparatus
IBM99 citations97
US6569252B1May 27, 2003
Semi-aqueous solvent cleaning of paste processing residue from substrates
IBM44 citations96
US5888308AMar 30, 1999
Process for removing residue from screening masks with alkaline solution
IBM53 citations95
US6277799B1Aug 21, 2001
Aqueous cleaning of paste residue
IBM33 citations92
US5927193AJul 27, 1999
Process for via fill
IBM50 citations92
US6280527B1Aug 28, 2001
Aqueous quaternary ammonium hydroxide as a screening mask cleaner
IBM27 citations91
US6032683AMar 7, 2000
System for cleaning residual paste from a mask
IBM19 citations91
US5916374AJun 29, 1999
Optimized in-line mask cleaning system
IBM24 citations91
US5645673AJul 8, 1997
Lamination process for producing non-planar substrates
IBM31 citations90
US6532654B2Mar 18, 2003
Method of forming an electrical connector
IBM38 citations89
US6351871B1Mar 5, 2002
Aqueous quaternary ammonium hydroxide as a screening mask cleaner
IBM14 citations82
US6442825B1Sep 3, 2002
Lapping and polishing fixture having flexible sides
IBM7 citations74
US6038931AMar 21, 2000
Method and apparatus for the testing of plastically deformable objects
IBM7 citations72
US5846361ADec 8, 1998
Lamination process for producing non-planar substrates
IBM15 citations71
US7781232B2Aug 24, 2010
Method to recover underfilled modules by selective removal of discrete components
IBM6 citations63
US6152807ANov 28, 2000
Lapping and polishing fixture having flexible sides
IBM3 citations63
US6742530B2Jun 1, 2004
Semi-aqueous solvent cleaning of paste processing residue from substrates
IBM2 citations62
US7294909B2Nov 13, 2007
Electronic package repair process
IBM2 citations60
US6823585B2Nov 30, 2004
Method of selective plating on a substrate
IBM2 citations60
US6835260B2Dec 28, 2004
Method to produce pedestal features in constrained sintered substrates
IBM1 citations51
US6916670B2Jul 12, 2005
Electronic package repair process
IBM1 citations49
US11393759B2Jul 19, 2022
Alignment carrier for interconnect bridge assembly
IBM0 citations48