Inventor

LEACH MICHAEL A

US18 patents

⚠️ This page may combine multiple inventors who share the name “LEACH MICHAEL A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEACH MICHAEL A

IBM

Wafer flood polishing

In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection

Device and method for detecting an end point in polishing operation

Process for defining organic sidewall structures

Via-filling and planarization technique

Polishstop planarization structure

Polishstop planarization method and structure

Device for detecting an end point in polishing operations

Method of measuring changes in impedance of a variable impedance load by disposing an impedance connected coil within the air gap of a magnetic core

VLSI coaxial wiring structure

System for mechanical planarization

Method of forming conductors within an insulating substrate

Wafer polishing and endpoint detection

Method of forming conductors within an insulating substrate

(unassigned)

Method and structure for polishing a wafer during manufacture of integrated circuits

Method and structure for polishing a wafer during manufacture of integrated circuits

Polishing a workpiece using equal velocity at all points overlapping a polisher

Block for polishing a wafer during manufacture of integrated circuits